PI6CB18200ZDIE
Manufacturer No:
PI6CB18200ZDIE
Manufacturer:
Description:
IC CLK BUFFER 1:1 125MHZ 24TQFN
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In Stock : 0
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PI6CB18200ZDIE Specifications
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TypeParameter
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Package / Case24-VFQFN Exposed Pad
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C
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Voltage - Supply1.7V ~ 1.9V
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OutputHCSL
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Differential - Input:OutputNo/Yes
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Ratio - Input:Output1:1
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Number of Circuits1
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Product StatusObsolete
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PackagingTray
The PI6CB18200ZDIE integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-speed data transmission: These chips support data rates up to 20 Gbps, making them suitable for high-speed communication applications. 2. Low power consumption: They are designed to operate with low power consumption, making them energy-efficient. 3. Compact size: The chips are small in size, allowing for space-saving designs in electronic devices. 4. Low jitter and noise: They provide excellent signal integrity by minimizing jitter and noise, ensuring reliable data transmission. 5. Wide operating temperature range: These chips can operate in a wide temperature range, making them suitable for various environments.Application scenarios: 1. Data centers: The high-speed data transmission capability of these chips makes them ideal for use in data centers, where large amounts of data need to be transmitted quickly and reliably. 2. High-speed communication systems: They can be used in high-speed communication systems such as optical networks, Ethernet switches, and routers. 3. Consumer electronics: These chips can be used in consumer electronic devices like smartphones, tablets, and laptops to enable high-speed data transfer between different components. 4. Automotive applications: They can be used in automotive systems for high-speed data communication between different modules and components. 5. Industrial applications: These chips can be used in industrial automation systems, where high-speed and reliable data transmission is required.Overall, the PI6CB18200ZDIE integrated circuit chips offer high-speed data transmission, low power consumption, and compact size, making them suitable for various applications in data centers, communication systems, consumer electronics, automotive, and industrial sectors.
PI6CB18200ZDIE Relevant information