8305AGLF-TEJ

8305AGLF-TEJ

Manufacturer No:

8305AGLF-TEJ

Description:

IC CLK BUFFER 2:4 350MHZ 16TSSOP

Datasheet:

Datasheet

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8305AGLF-TEJ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Voltage - Supply
    3.135V ~ 3.465V
  • Differential - Input:Output
    Yes/No
  • Number of Circuits
    1
  • Product Status
    Obsolete
  • Packaging
    Tube
The 8305AGLF-TEJ integrated circuit chips have several advantages and application scenarios:Advantages: 1. Low power consumption: These chips are designed to operate with low power requirements, making them suitable for battery-powered devices or energy-efficient applications. 2. Small form factor: The chips are compact in size, allowing for easy integration into various electronic devices with limited space. 3. High performance: They offer high-speed data processing capabilities, enabling efficient data transmission and processing. 4. Wide operating temperature range: The chips can operate reliably in a wide range of temperatures, making them suitable for harsh environments. 5. Robust communication features: They support various communication protocols, such as I2C, SPI, UART, etc., facilitating seamless connectivity with other devices.Application scenarios: 1. Internet of Things (IoT): The chips can be used in IoT devices for wireless communication, sensor data processing, and connectivity with other IoT devices or cloud platforms. 2. Wearable devices: Due to their low power consumption and small form factor, these chips are suitable for wearable devices like smartwatches, fitness trackers, etc., where space and power efficiency are crucial. 3. Home automation: They can be used in smart home devices for communication between different appliances, sensors, and control systems, enabling automation and remote control. 4. Industrial automation: The chips can be utilized in industrial applications for data acquisition, control, and communication between various machines and systems. 5. Medical devices: Due to their high performance and reliability, these chips can be used in medical devices for data processing, wireless communication, and connectivity with healthcare systems.Overall, the 8305AGLF-TEJ integrated circuit chips offer low power consumption, small form factor, high performance, and robust communication features, making them suitable for a wide range of applications in IoT, wearables, home automation, industrial automation, and medical devices.