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IDT74FCT3807DPGI8

IDT74FCT3807DPGI8

Manufacturer No:

IDT74FCT3807DPGI8

Description:

IC CLK BUF 1:10 166MHZ 20TSSOP

Datasheet:

Datasheet

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IDT74FCT3807DPGI8 Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-TSSOP
  • Package / Case
    20-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    3V ~ 3.6V
  • Differential - Input:Output
    No/No
  • Ratio - Input:Output
    1:10
  • Number of Circuits
    1
  • Product Status
    Obsolete
  • Packaging
    Tape & Reel (TR)
The IDT74FCT3807DPGI8 is a specific integrated circuit chip manufactured by IDT (Integrated Device Technology). It is a 1:10 Differential-to-LVCMOS/LVTTL Fanout Buffer. Here are some advantages and application scenarios of this chip:Advantages: 1. High-speed operation: The IDT74FCT3807DPGI8 chip is designed to operate at high speeds, making it suitable for applications that require fast data transfer and signal processing. 2. Low power consumption: It is designed to consume low power, making it energy-efficient and suitable for battery-powered devices or applications where power efficiency is crucial. 3. Differential-to-LVCMOS/LVTTL conversion: The chip provides a conversion from differential signals to LVCMOS/LVTTL logic levels, allowing seamless integration with different types of logic circuits. 4. Fanout capability: The chip has a fanout capability of 1:10, which means it can drive up to ten output loads without significant degradation in signal quality. 5. Wide operating voltage range: It can operate within a wide voltage range, typically from 3.0V to 5.5V, providing flexibility in various applications.Application Scenarios: 1. High-speed data communication: The IDT74FCT3807DPGI8 chip can be used in applications that require high-speed data communication, such as networking equipment, data centers, or telecommunications systems. 2. Clock distribution: It can be used for clock distribution in systems where a single clock signal needs to be distributed to multiple components or subsystems. 3. Memory interfaces: The chip can be used in memory interfaces, such as DDR (Double Data Rate) memory systems, to buffer and distribute clock and control signals. 4. Test and measurement equipment: It can be used in test and measurement equipment to buffer and distribute signals accurately and efficiently. 5. Industrial automation: The chip can be used in industrial automation systems where high-speed and reliable signal distribution is required.It is important to note that the specific application scenarios may vary depending on the requirements and specifications of the overall system design.
IDT74FCT3807DPGI8 Relevant information