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IDT2309NZ-1HDCI

IDT2309NZ-1HDCI

Manufacturer No:

IDT2309NZ-1HDCI

Description:

IC CLK BUF 1:9 133.33MHZ 16SOIC

Datasheet:

Datasheet

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IDT2309NZ-1HDCI Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    3V ~ 3.6V
  • Differential - Input:Output
    No/No
  • Number of Circuits
    1
  • Product Status
    Obsolete
  • Packaging
    Tube
The IDT2309NZ-1HDCI integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-speed data transmission: These chips are designed to support high-speed data rates, making them suitable for applications that require fast and efficient data transfer. 2. Low power consumption: The IDT2309NZ-1HDCI chips are designed to operate with low power consumption, making them ideal for battery-powered devices or applications where power efficiency is crucial. 3. Compact size: These chips are available in a compact form factor, allowing for easy integration into small devices or systems with limited space. 4. High reliability: The IDT2309NZ-1HDCI chips are built with high-quality components and undergo rigorous testing, ensuring their reliability and durability in various operating conditions. 5. Easy integration: These chips are designed to be easily integrated into existing systems, making them suitable for a wide range of applications without significant modifications.Application scenarios: 1. High-definition video transmission: The IDT2309NZ-1HDCI chips can be used in applications that require the transmission of high-definition video signals, such as video conferencing systems, digital signage, or multimedia streaming devices. 2. Data storage and networking: These chips can be utilized in data storage systems, network switches, or routers to enable high-speed data transfer between devices or over networks. 3. Medical imaging: The IDT2309NZ-1HDCI chips can be employed in medical imaging equipment, such as ultrasound machines or digital X-ray systems, to transmit high-resolution images quickly and efficiently. 4. Industrial automation: These chips can be used in industrial automation systems, such as robotics or machine vision applications, to enable fast and reliable data communication between different components or devices. 5. Automotive electronics: The IDT2309NZ-1HDCI chips can be utilized in automotive electronics, such as infotainment systems or advanced driver-assistance systems (ADAS), to support high-speed data transfer for audio, video, or sensor data.Overall, the IDT2309NZ-1HDCI integrated circuit chips offer advantages in terms of high-speed data transmission, low power consumption, compact size, reliability, and easy integration, making them suitable for various applications requiring efficient data transfer.
IDT2309NZ-1HDCI Relevant information