8737AGI-11LF
Manufacturer No:
8737AGI-11LF
Manufacturer:
Description:
IC CLK BUFFER 2:2 650MHZ 20TSSOP
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8737AGI-11LF Specifications
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TypeParameter
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Supplier Device Package20-TSSOP
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Package / Case20-TSSOP (0.173", 4.40mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C
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Voltage - Supply3.135V ~ 3.465V
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Differential - Input:OutputYes/Yes
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Number of Circuits1
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Product StatusObsolete
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PackagingTube
The 8737AGI-11LF integrated circuit (IC) chips are primarily used in wireless communication systems. Here are some advantages and application scenarios of these chips:Advantages: 1. High Performance: The 8737AGI-11LF chips offer excellent performance in terms of signal quality, data transmission speed, and range. 2. Low Power Consumption: These chips are designed to operate efficiently with low power consumption, making them suitable for battery-powered devices. 3. Compact Size: The IC chips are compact in size, allowing for easy integration into various devices and systems. 4. Wide Frequency Range: The chips support a wide frequency range, enabling them to be used in different wireless communication standards and protocols. 5. Robustness: The 8737AGI-11LF chips are designed to be robust and reliable, ensuring stable and uninterrupted communication.Application Scenarios: 1. Internet of Things (IoT): The chips can be used in IoT devices that require wireless connectivity, such as smart home devices, industrial sensors, and wearable devices. 2. Wireless Sensor Networks: These chips are suitable for wireless sensor networks used in applications like environmental monitoring, asset tracking, and industrial automation. 3. Wireless Communication Modules: The IC chips can be integrated into communication modules for applications like wireless data transmission, remote control systems, and telemetry. 4. Smart Metering: The chips can be used in smart metering systems for electricity, water, and gas, enabling wireless communication between meters and central monitoring systems. 5. Wireless Audio/Video Streaming: The chips can be utilized in wireless audio and video streaming devices, such as wireless speakers, headphones, and video transmission systems.Overall, the 8737AGI-11LF IC chips offer high-performance wireless communication capabilities with low power consumption, making them suitable for a wide range of applications in various industries.
8737AGI-11LF Relevant information