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87004BG-03LFT

87004BG-03LFT

Manufacturer No:

87004BG-03LFT

Description:

IC CLK BUFFER 2:4 250MHZ 20TSSOP

Datasheet:

Datasheet

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87004BG-03LFT Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-TSSOP
  • Package / Case
    20-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Differential - Input:Output
    No/No
  • Number of Circuits
    1
  • Product Status
    Active
  • Packaging
    Tape & Reel (TR)
The 87004BG-03LFT integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips offer high-speed data transmission and processing capabilities, making them suitable for applications that require fast and efficient data handling. 2. Low Power Consumption: The chips are designed to operate with low power consumption, making them ideal for battery-powered devices or applications where energy efficiency is crucial. 3. Small Form Factor: The chips are compact in size, allowing for easy integration into various electronic devices and systems. 4. Wide Operating Temperature Range: These chips can operate reliably in a wide temperature range, making them suitable for applications in harsh environments. 5. Robust Communication: The chips support reliable and secure communication protocols, ensuring data integrity and protection.Application Scenarios: 1. Networking Equipment: The chips can be used in routers, switches, and other networking equipment to enable high-speed data transmission and processing. 2. Industrial Automation: These chips can be utilized in industrial automation systems for real-time data processing, control, and communication. 3. Internet of Things (IoT): The chips can be integrated into IoT devices, such as smart home appliances, wearables, and sensors, to enable efficient data communication and processing. 4. Automotive Electronics: These chips can be used in automotive applications, such as advanced driver-assistance systems (ADAS), infotainment systems, and vehicle-to-vehicle communication. 5. Telecommunications: The chips can be employed in telecommunications equipment, such as base stations and optical network devices, to enable high-speed data transmission and communication.Overall, the 87004BG-03LFT integrated circuit chips offer high performance, low power consumption, and robust communication capabilities, making them suitable for various applications in networking, industrial automation, IoT, automotive electronics, and telecommunications.
87004BG-03LFT Relevant information