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859S1601BGILFT

859S1601BGILFT

Manufacturer No:

859S1601BGILFT

Description:

IC CLK MULTIPLX 16:1 24TSSOP

Datasheet:

Datasheet

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859S1601BGILFT Specifications

  • Type
    Parameter
  • Supplier Device Package
    24-TSSOP
  • Package / Case
    24-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Output
    LVDS, LVPECL
  • Differential - Input:Output
    No/Yes
  • Number of Circuits
    1
  • Product Status
    Obsolete
  • Packaging
    Tape & Reel (TR)
The 859S1601BGILFT integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips offer high-speed data transfer and processing capabilities, making them suitable for applications that require fast and efficient operations. 2. Low Power Consumption: The chips are designed to consume minimal power, making them ideal for battery-powered devices or applications where power efficiency is crucial. 3. Compact Size: The chips are compact in size, allowing for easy integration into small form factor devices or applications with space constraints. 4. Versatility: These chips can be used in a wide range of applications, thanks to their flexible design and compatibility with various systems and protocols. 5. Reliability: The chips are built with high-quality materials and undergo rigorous testing, ensuring their reliability and durability in demanding environments.Application Scenarios: 1. Consumer Electronics: The chips can be used in smartphones, tablets, wearables, and other consumer electronic devices to enable wireless connectivity, data transfer, and communication. 2. Internet of Things (IoT): These chips can be integrated into IoT devices such as smart home appliances, industrial sensors, and healthcare devices to enable wireless connectivity and data exchange. 3. Automotive: The chips can be used in automotive applications for wireless communication, vehicle-to-vehicle connectivity, and advanced driver assistance systems. 4. Industrial Automation: These chips can be utilized in industrial automation systems for wireless communication, remote monitoring, and control of machinery and equipment. 5. Medical Devices: The chips can be integrated into medical devices for wireless data transfer, patient monitoring, and telemedicine applications. 6. Smart Grids: These chips can be used in smart grid systems for wireless communication, data exchange, and monitoring of energy consumption.Overall, the 859S1601BGILFT integrated circuit chips offer high performance, low power consumption, and versatility, making them suitable for various applications in consumer electronics, IoT, automotive, industrial automation, medical devices, and smart grids.
859S1601BGILFT Relevant information