85357AG-11LF

85357AG-11LF

Manufacturer No:

85357AG-11LF

Description:

IC CLK MULTIPLX 4:1/2:1 20TSSOP

Datasheet:

Datasheet

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85357AG-11LF Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-TSSOP
  • Package / Case
    20-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Voltage - Supply
    3.135V ~ 3.465V
  • Frequency - Max
    27 MHz
  • Differential - Input:Output
    No/Yes
  • Number of Circuits
    1
  • Product Status
    Obsolete
  • Packaging
    Tube
The 85357AG-11LF integrated circuit chips are part of the RF and Microwave product line from Integrated Device Technology (IDT). These chips offer several advantages and find application in various scenarios:1. High Performance: The 85357AG-11LF chips are designed to deliver high performance in terms of signal quality, sensitivity, and reliability. They are built using advanced semiconductor technologies, ensuring optimal performance in RF and microwave applications.2. Wide Frequency Range: These chips cover a wide frequency range, typically from 1 MHz to 6 GHz. This makes them suitable for a variety of applications, including wireless communication systems, radar systems, satellite communication, and more.3. Low Power Consumption: The 85357AG-11LF chips are designed to operate with low power consumption. This is particularly advantageous in battery-powered devices or applications where power efficiency is crucial.4. Small Form Factor: These chips are available in compact packages, making them suitable for space-constrained applications. Their small form factor allows for easy integration into various systems and devices.5. High Integration: The 85357AG-11LF chips offer high integration capabilities, combining multiple functions into a single chip. This simplifies the design process, reduces component count, and improves overall system performance.Application scenarios for the 85357AG-11LF chips include:1. Wireless Communication Systems: These chips can be used in wireless communication systems such as cellular base stations, Wi-Fi routers, and Bluetooth devices. They enable signal amplification, filtering, and frequency conversion, ensuring reliable and high-quality wireless communication.2. Radar Systems: The chips find application in radar systems, including weather radar, automotive radar, and military radar. They help in signal processing, frequency generation, and amplification, enabling accurate detection and tracking of targets.3. Satellite Communication: The 85357AG-11LF chips can be used in satellite communication systems for signal reception, amplification, and frequency conversion. They ensure efficient and reliable communication between satellites and ground stations.4. Test and Measurement Equipment: These chips are suitable for test and measurement equipment used in RF and microwave applications. They provide accurate signal analysis, generation, and modulation capabilities, facilitating precise measurements and analysis.Overall, the 85357AG-11LF integrated circuit chips offer high performance, wide frequency range, low power consumption, and small form factor, making them versatile for various RF and microwave applications.