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8302AM-01LF

8302AM-01LF

Manufacturer No:

8302AM-01LF

Description:

IC CLK BUFFER 1:2 250MHZ 8SOIC

Datasheet:

Datasheet

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8302AM-01LF Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Voltage - Supply
    3.135V ~ 3.465V
  • Differential - Input:Output
    No/Yes
  • Ratio - Input:Output
    1:2
  • Number of Circuits
    1
  • Product Status
    Obsolete
  • Packaging
    Tube
The 8302AM-01LF integrated circuit chips have several advantages and application scenarios:Advantages: 1. Low power consumption: These chips are designed to operate with low power requirements, making them suitable for battery-powered devices or energy-efficient applications. 2. Small form factor: The chips are compact in size, allowing for easy integration into space-constrained designs or miniaturized devices. 3. High performance: Despite their small size, these chips offer high performance capabilities, enabling efficient data processing and communication. 4. Wide operating voltage range: The chips can operate within a wide voltage range, making them compatible with various power supply configurations. 5. Cost-effective: These chips are designed to be cost-effective, making them suitable for mass production and cost-sensitive applications.Application Scenarios: 1. Internet of Things (IoT): The low power consumption and small form factor of these chips make them ideal for IoT devices, such as smart sensors, wearables, or connected appliances. 2. Wireless communication: The chips can be used in wireless communication systems, such as Bluetooth or Wi-Fi modules, to enable data transmission and reception. 3. Consumer electronics: These chips can be integrated into various consumer electronic devices, including smartphones, tablets, or smart home devices, to enhance their functionality and performance. 4. Industrial automation: The chips can be utilized in industrial automation systems, such as process control or monitoring devices, to enable efficient data processing and communication. 5. Medical devices: The low power consumption and compact size of these chips make them suitable for medical devices, such as remote patient monitoring systems or implantable devices.Overall, the 8302AM-01LF integrated circuit chips offer advantages in terms of power consumption, size, performance, and cost-effectiveness, making them versatile for various applications in IoT, wireless communication, consumer electronics, industrial automation, and medical devices.
8302AM-01LF Relevant information