ICS2304NZGI-1T

ICS2304NZGI-1T

Manufacturer No:

ICS2304NZGI-1T

Description:

IC CLK BUFFER 1:4 140MHZ 8TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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ICS2304NZGI-1T Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-TSSOP
  • Package / Case
    8-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    3V ~ 3.6V
  • Differential - Input:Output
    No/No
  • Ratio - Input:Output
    1:4
  • Number of Circuits
    1
  • Product Status
    Obsolete
  • Packaging
    Tape & Reel (TR)
ICS2304NZGI-1T is a specific model of integrated circuit chips. However, without more information about the specific features and capabilities of this chip, it is difficult to provide a comprehensive list of advantages and application scenarios. Generally, integrated circuit chips are used in a wide range of electronic devices and systems. They can be found in computers, smartphones, televisions, automotive systems, medical devices, and many other applications. Integrated circuits provide various advantages, such as:1. Miniaturization: Integrated circuits allow for the miniaturization of electronic components, enabling the development of smaller and more compact devices. 2. Cost-effectiveness: Integrated circuits can be mass-produced, leading to lower production costs and making electronic devices more affordable. 3. Power efficiency: Integrated circuits are designed to be power-efficient, helping to extend battery life in portable devices and reduce energy consumption in larger systems. 4. Reliability: Integrated circuits are highly reliable due to their compact design and reduced number of interconnections, minimizing the risk of failure. 5. Performance: Integrated circuits can provide high-speed processing, improved signal quality, and advanced functionality, enhancing the performance of electronic systems.To determine the specific advantages and application scenarios of ICS2304NZGI-1T integrated circuit chips, it is necessary to refer to the datasheet or technical documentation provided by the manufacturer. This documentation typically includes information about the chip's features, specifications, and recommended applications.