MC100LVEP210MNRG

MC100LVEP210MNRG

Manufacturer No:

MC100LVEP210MNRG

Manufacturer:

onsemi

Description:

IC CLK BUFFER 1:5 3GHZ 32QFN

Datasheet:

Datasheet

Delivery:

Payment:

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MC100LVEP210MNRG Specifications

  • Type
    Parameter
  • Supplier Device Package
    32-QFN (5x5)
  • Package / Case
    32-VFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Output
    ECL, PECL
  • Differential - Input:Output
    Yes/Yes
  • Ratio - Input:Output
    1:5
  • Number of Circuits
    2
  • Product Status
    Obsolete
  • Packaging
    Tape & Reel (TR)
  • Series
    100LVEP
The MC100LVEP210MNRG is a high-speed differential receiver integrated circuit chip. Some of its advantages and application scenarios include:Advantages: 1. High-speed operation: The chip is designed to operate at very high speeds, making it suitable for applications that require fast data transmission. 2. Low jitter: It provides low jitter performance, ensuring accurate and reliable data reception. 3. Differential signaling: The chip uses differential signaling, which helps in reducing noise and improving signal integrity. 4. Wide operating voltage range: It can operate over a wide range of supply voltages, making it versatile and compatible with various systems. 5. ECL compatibility: The chip is compatible with ECL (Emitter-Coupled Logic) logic levels, allowing for easy integration with other ECL-based systems.Application scenarios: 1. High-speed data communication: The MC100LVEP210MNRG chip is commonly used in applications that require high-speed data transmission, such as telecommunications, networking, and data centers. 2. Clock and data recovery: It can be used in clock and data recovery circuits, where it helps in recovering the clock and data signals from high-speed serial data streams. 3. Test and measurement equipment: The chip finds applications in test and measurement equipment that require high-speed signal processing and accurate data reception. 4. High-speed digital design: It is used in the design of high-speed digital systems, such as high-performance computers, servers, and data storage devices. 5. Fiber optic communication: The chip can be employed in fiber optic communication systems to receive and process high-speed optical signals.Overall, the MC100LVEP210MNRG integrated circuit chip is well-suited for applications that demand high-speed data transmission, low jitter, and reliable signal reception.