IDT74FCT810BTPYG8

IDT74FCT810BTPYG8

Manufacturer No:

IDT74FCT810BTPYG8

Description:

IC CLK BUFFER 1:5 100MHZ 20SSOP

Datasheet:

Datasheet

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IDT74FCT810BTPYG8 Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-SSOP
  • Package / Case
    20-SSOP (0.209", 5.30mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Voltage - Supply
    4.75V ~ 5.25V
  • Differential - Input:Output
    No/No
  • Ratio - Input:Output
    1:5
  • Number of Circuits
    2
  • Product Status
    Obsolete
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
The IDT74FCT810BTPYG8 is a specific integrated circuit chip manufactured by IDT (Integrated Device Technology). It is a high-speed, low-power octal buffer/line driver with 3-state outputs. Here are some advantages and application scenarios of this chip:Advantages: 1. High-speed operation: The IDT74FCT810BTPYG8 chip is designed to operate at high speeds, making it suitable for applications that require fast data transfer and processing. 2. Low power consumption: It is a low-power chip, which helps in reducing overall power consumption in electronic systems. 3. 3-state outputs: The chip has 3-state outputs, which means it can be easily connected to a bus or shared communication lines without causing conflicts or data corruption. 4. Wide operating voltage range: It can operate within a wide voltage range, typically from 4.5V to 5.5V, making it compatible with various power supply configurations.Application scenarios: 1. Data communication systems: The IDT74FCT810BTPYG8 chip can be used in data communication systems, such as Ethernet switches, routers, and network interface cards, to buffer and drive data signals between different components. 2. Memory systems: It can be used in memory systems, like RAM (Random Access Memory) or cache memory, to buffer and drive address and data signals between the memory modules and the memory controller. 3. Industrial automation: The chip can be utilized in industrial automation systems, where it can buffer and drive control signals between different components, such as sensors, actuators, and programmable logic controllers (PLCs). 4. Test and measurement equipment: It can be employed in test and measurement equipment, like oscilloscopes or logic analyzers, to buffer and drive signals during signal analysis or testing processes. 5. Embedded systems: The chip can be integrated into various embedded systems, such as microcontrollers or digital signal processors (DSPs), to buffer and drive signals between different peripherals or external devices.It is important to note that the specific application scenarios may vary depending on the requirements and design of the electronic system.