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SY89876LMI TR

SY89876LMI TR

Manufacturer No:

SY89876LMI TR

Manufacturer:

Microchip Technology

Description:

IC CLK BUFFER 1:2 2GHZ 16MLF

Datasheet:

Datasheet

Delivery:

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SY89876LMI TR Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-MLF® (3x3)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    2.97V ~ 3.63V
  • Output
    LVDS
  • Differential - Input:Output
    Yes/Yes
  • Ratio - Input:Output
    1:2
  • Number of Circuits
    1
  • Product Status
    Obsolete
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Series
    Precision Edge®
The SY89876LMI TR is a specific integrated circuit chip designed for high-speed signal transmission and amplification. Some of its advantages and application scenarios include:1. High-speed signal transmission: The SY89876LMI TR chip is designed to handle high-speed signals, making it suitable for applications that require fast data transmission, such as telecommunications, networking, and data centers.2. Low power consumption: This chip is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial.3. Small form factor: The SY89876LMI TR chip is available in a small form factor, making it suitable for applications with space constraints, such as portable devices or compact electronic systems.4. Signal amplification: This chip includes built-in amplification capabilities, allowing it to boost weak signals or compensate for signal losses in long-distance transmission scenarios.5. Wide operating voltage range: The SY89876LMI TR chip can operate within a wide voltage range, making it compatible with various power supply configurations and ensuring flexibility in different application scenarios.6. High reliability: This chip is designed to provide high reliability and robust performance, making it suitable for applications that require continuous and stable operation.Application scenarios for the SY89876LMI TR chip may include:1. High-speed data communication: The chip can be used in networking equipment, such as routers, switches, and optical transceivers, to enable fast and reliable data transmission.2. Telecommunications: The chip can be used in telecommunications infrastructure, such as base stations or communication satellites, to handle high-speed signal processing and transmission.3. Data centers: The chip can be used in data centers to amplify and transmit high-speed signals between servers, switches, and storage systems.4. Portable devices: The small form factor and low power consumption of the chip make it suitable for integration into portable devices, such as smartphones, tablets, or wearable devices, where high-speed signal processing is required.5. Industrial applications: The chip can be used in industrial automation systems, where high-speed signal transmission and amplification are necessary for control and monitoring purposes.Overall, the SY89876LMI TR chip offers advantages in terms of high-speed signal transmission, low power consumption, small form factor, and reliability, making it suitable for various applications that require fast and efficient signal processing.
SY89876LMI TR Relevant information