MC10LVEP11DTR2

MC10LVEP11DTR2

Manufacturer No:

MC10LVEP11DTR2

Manufacturer:

onsemi

Description:

IC CLK BUFFER 1:2 3GHZ 8TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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MC10LVEP11DTR2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-TSSOP
  • Package / Case
    8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Output
    ECL, PECL
  • Differential - Input:Output
    Yes/Yes
  • Ratio - Input:Output
    1:2
  • Number of Circuits
    1
  • Product Status
    Obsolete
  • Packaging
    Tape & Reel (TR)
The MC10LVEP11DTR2 is a high-speed differential receiver integrated circuit chip. It is part of the MC10LVEPxx series, which is designed for applications requiring high-speed data transmission and clock distribution. Here are some advantages and application scenarios of the MC10LVEP11DTR2:Advantages: 1. High-speed operation: The MC10LVEP11DTR2 operates at very high speeds, making it suitable for applications that require fast data transmission and clock distribution. 2. Low jitter: It has low jitter characteristics, ensuring accurate and reliable data transmission. 3. Differential signaling: The chip uses differential signaling, which provides better noise immunity and reduces electromagnetic interference. 4. Wide operating voltage range: It operates over a wide voltage range, making it compatible with various power supply levels. 5. Small form factor: The chip comes in a small package, making it suitable for space-constrained applications.Application scenarios: 1. High-speed data communication: The MC10LVEP11DTR2 can be used in high-speed data communication systems, such as fiber optic networks, where fast and reliable data transmission is required. 2. Clock distribution: It can be used in clock distribution systems, where precise and low-jitter clock signals need to be distributed to multiple components or subsystems. 3. Test and measurement equipment: The chip can be used in high-speed test and measurement equipment, such as oscilloscopes or logic analyzers, to capture and analyze fast digital signals. 4. Data storage systems: It can be used in high-speed data storage systems, such as solid-state drives (SSDs), to interface with high-speed data buses and ensure reliable data transfer. 5. High-performance computing: The chip can be used in high-performance computing systems, such as servers or supercomputers, to handle fast data processing and communication between different components.Overall, the MC10LVEP11DTR2 integrated circuit chip offers high-speed, low-jitter, and reliable data transmission capabilities, making it suitable for various applications that require fast and accurate signal processing.