MC10EP11DTR2G

MC10EP11DTR2G

Manufacturer No:

MC10EP11DTR2G

Manufacturer:

onsemi

Description:

IC CLK BUFFER 1:2 3GHZ 8TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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MC10EP11DTR2G Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-TSSOP
  • Package / Case
    8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    3V ~ 5.5V
  • Output
    ECL, PECL
  • Differential - Input:Output
    Yes/Yes
  • Ratio - Input:Output
    1:2
  • Number of Circuits
    1
  • Product Status
    Obsolete
  • Packaging
    Tape & Reel (TR)
  • Series
    10EP
The MC10EP11DTR2G is a high-speed differential receiver integrated circuit chip manufactured by ON Semiconductor. It is designed for applications that require high-speed data transmission and reception. Here are some advantages and application scenarios of this chip:Advantages: 1. High-speed operation: The MC10EP11DTR2G is capable of operating at very high frequencies, making it suitable for applications that require fast data transmission and reception. 2. Low jitter: It has low jitter characteristics, which ensures accurate and reliable data reception. 3. Differential input: The chip has a differential input, which allows it to receive differential signals and reject common-mode noise, resulting in improved signal integrity. 4. Wide operating voltage range: It can operate over a wide voltage range, typically from -3.0V to -5.5V, making it compatible with various power supply configurations.Application scenarios: 1. High-speed data communication: The MC10EP11DTR2G can be used in high-speed data communication systems, such as fiber optic networks, where fast and accurate data reception is crucial. 2. Clock and data recovery: It can be used in clock and data recovery circuits, which are essential in systems that require synchronization and accurate data retrieval. 3. Test and measurement equipment: The chip can be utilized in high-speed test and measurement equipment, where it can receive and process high-frequency signals accurately. 4. Data storage systems: It can be employed in data storage systems, such as solid-state drives (SSDs), where it can receive and process high-speed data signals from memory devices.Overall, the MC10EP11DTR2G integrated circuit chip is advantageous for high-speed data transmission and reception applications, offering low jitter, differential input, and wide operating voltage range. Its application scenarios include high-speed data communication, clock and data recovery, test and measurement equipment, and data storage systems.