MC10EL11DTR2G

MC10EL11DTR2G

Manufacturer No:

MC10EL11DTR2G

Manufacturer:

onsemi

Description:

IC CLK BUFFER 1:2 1.5GHZ 8TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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MC10EL11DTR2G Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-TSSOP
  • Package / Case
    8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    4.2V ~ 5.7V
  • Output
    ECL, PECL
  • Differential - Input:Output
    Yes/Yes
  • Ratio - Input:Output
    1:2
  • Number of Circuits
    1
  • Product Status
    Obsolete
  • Packaging
    Tape & Reel (TR)
  • Series
    10EL
The MC10EL11DTR2G is a high-speed differential receiver integrated circuit chip manufactured by ON Semiconductor. It is part of the ECLinPS MAX family of devices and offers several advantages and application scenarios:Advantages: 1. High-speed operation: The MC10EL11DTR2G is designed to operate at very high speeds, making it suitable for applications that require fast data transmission and processing. 2. Low power consumption: It has low power dissipation, making it energy-efficient and suitable for battery-powered devices or applications where power consumption is a concern. 3. Differential inputs: The chip has differential inputs, which provide better noise immunity and common-mode rejection, making it suitable for applications in noisy environments. 4. Wide operating voltage range: It can operate over a wide voltage range, typically from -4.2V to -5.7V, allowing flexibility in different power supply configurations. 5. Small form factor: The chip comes in a small package, making it suitable for space-constrained applications.Application scenarios: 1. High-speed data communication: The MC10EL11DTR2G can be used in high-speed data communication systems, such as fiber-optic networks, where fast and reliable data transmission is required. 2. Clock and data recovery: It can be used in clock and data recovery circuits, which are essential in high-speed communication systems to extract clock signals and data from incoming signals. 3. Test and measurement equipment: The chip can be used in test and measurement equipment, such as oscilloscopes or logic analyzers, to process and analyze high-speed signals accurately. 4. Industrial automation: It can be used in industrial automation systems, where high-speed data processing and communication are required for control and monitoring purposes. 5. High-performance computing: The chip can be used in high-performance computing systems, such as servers or supercomputers, to handle high-speed data processing and communication between different components.It is important to note that the specific application scenarios may vary depending on the system requirements and design considerations.