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SY58011UMI-TR

SY58011UMI-TR

Manufacturer No:

SY58011UMI-TR

Manufacturer:

Microchip Technology

Description:

IC CLK BUFFER 1:2 8GHZ 16MLF

Datasheet:

Datasheet

Delivery:

Payment:

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SY58011UMI-TR Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-MLF® (3x3)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    2.375V ~ 3.6V
  • Output
    CML
  • Input
    CML, LVDS, LVPECL
  • Differential - Input:Output
    Yes/Yes
  • Ratio - Input:Output
    1:2
  • Number of Circuits
    1
  • Product Status
    Discontinued at Digi-Key
  • Packaging
    Tape & Reel (TR)
  • Series
    Precision Edge®
The SY58011UMI-TR is a specific integrated circuit chip designed for high-speed signal transmission. Some of its advantages and application scenarios include:1. High-speed data transmission: The SY58011UMI-TR chip is designed to support data rates up to 12.5 Gbps. This makes it suitable for applications that require fast and reliable data transmission, such as high-speed networking, telecommunications, and data centers.2. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial.3. Small form factor: The SY58011UMI-TR chip comes in a small form factor, making it suitable for applications with limited space, such as portable devices or compact electronic systems.4. Differential signaling: The chip supports differential signaling, which helps in reducing noise and improving signal integrity. This makes it suitable for applications that require high signal quality, such as high-speed data transmission over long distances.5. Wide operating temperature range: The chip is designed to operate over a wide temperature range, typically from -40°C to 85°C. This makes it suitable for applications that require operation in harsh environments or extreme temperature conditions.Application scenarios for the SY58011UMI-TR chip include:1. High-speed networking: The chip can be used in networking equipment, such as routers, switches, and network interface cards, to enable high-speed data transmission between devices.2. Telecommunications: The chip can be used in telecommunications equipment, such as optical transceivers or base stations, to enable high-speed data transmission over long distances.3. Data centers: The chip can be used in data center equipment, such as servers or storage systems, to enable fast and reliable data transmission between different components within the data center.4. Portable devices: The chip's low power consumption and small form factor make it suitable for use in portable devices, such as smartphones, tablets, or wearable devices, where high-speed data transmission is required.5. Industrial applications: The chip's wide operating temperature range and high-speed capabilities make it suitable for various industrial applications, such as industrial automation, robotics, or control systems, where reliable and fast data transmission is essential.
SY58011UMI-TR Relevant information