5PB1102PGGK8
Manufacturer No:
5PB1102PGGK8
Manufacturer:
Description:
IC CLK BUFFER 1:2 200MHZ 8TSSOP
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In Stock : 0
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5PB1102PGGK8 Specifications
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TypeParameter
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Supplier Device Package8-TSSOP
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Package / Case8-TSSOP (0.173", 4.40mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 105°C (TA)
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Differential - Input:OutputNo/No
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Ratio - Input:Output1:2
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Number of Circuits1
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Product StatusActive
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PackagingTape & Reel (TR)
The 5PB1102PGGK8 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are designed to deliver high performance with low power consumption, making them suitable for various applications. 2. Versatility: They can be used in a wide range of applications due to their flexible architecture and programmability. 3. Compact Size: The chips are compact in size, making them suitable for space-constrained applications. 4. Reliability: They are designed to be highly reliable and can operate in harsh environments. 5. Cost-effective: These chips offer a cost-effective solution for various applications.Application Scenarios: 1. Internet of Things (IoT): The 5PB1102PGGK8 chips can be used in IoT devices for connectivity, data processing, and control functions. 2. Industrial Automation: They can be used in industrial automation systems for control and monitoring purposes. 3. Automotive: These chips can be used in automotive applications such as advanced driver-assistance systems (ADAS) and infotainment systems. 4. Consumer Electronics: They can be used in various consumer electronic devices such as smartphones, tablets, and wearables for processing and connectivity. 5. Communication Systems: The chips can be used in communication systems for signal processing, modulation, and demodulation functions.These are just a few examples of the many possible applications and advantages of the 5PB1102PGGK8 integrated circuit chips. The specific use case will depend on the requirements and needs of the application.
5PB1102PGGK8 Relevant information