M100LVEP111FATWG

M100LVEP111FATWG

Manufacturer No:

M100LVEP111FATWG

Manufacturer:

onsemi

Description:

IC CLK BUFFER 2:10 3GHZ 32LQFP

Datasheet:

Datasheet

Delivery:

Payment:

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M100LVEP111FATWG Specifications

  • Type
    Parameter
  • Supplier Device Package
    32-LQFP (7x7)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Output
    ECL, PECL
  • Differential - Input:Output
    Yes/Yes
  • Number of Circuits
    1
  • Product Status
    Active
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Series
    100LVEP
The M100LVEP111FATWG integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-speed operation: These chips are designed for high-speed applications, offering fast data transmission and processing capabilities. 2. Low voltage differential signaling (LVDS) support: LVDS technology allows for high-speed data transmission with low power consumption, making it suitable for applications that require high-speed data transfer over long distances. 3. Low jitter and skew: These chips provide low jitter and skew characteristics, ensuring accurate and reliable data transmission. 4. Wide operating temperature range: The M100LVEP111FATWG chips can operate in a wide temperature range, making them suitable for various environments and applications. 5. Small form factor: These chips are available in a compact form factor, enabling their integration into space-constrained applications.Application Scenarios: 1. Telecommunications: The high-speed and low power consumption features of these chips make them suitable for telecommunications applications, such as high-speed data transmission in optical networks or wireless communication systems. 2. Data centers: These chips can be used in data centers for high-speed data processing and transmission between servers, switches, and storage devices. 3. Industrial automation: The M100LVEP111FATWG chips can be utilized in industrial automation systems that require high-speed and reliable data communication, such as control systems, robotics, and machine vision applications. 4. Test and measurement equipment: These chips can be integrated into test and measurement equipment, such as oscilloscopes or logic analyzers, to ensure accurate and high-speed data acquisition and analysis. 5. Medical imaging: The high-speed data transmission capabilities of these chips make them suitable for medical imaging applications, such as ultrasound or MRI systems, where real-time data processing and transmission are crucial.Overall, the M100LVEP111FATWG integrated circuit chips offer high-speed, low power consumption, and reliable data transmission capabilities, making them suitable for various applications that require high-speed data processing and communication.