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2309NZ-1HDCG

2309NZ-1HDCG

Manufacturer No:

2309NZ-1HDCG

Description:

IC CLK BUF 1:9 133.33MHZ 16SOIC

Datasheet:

Datasheet

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2309NZ-1HDCG Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Voltage - Supply
    3V ~ 3.6V
  • Differential - Input:Output
    No/No
  • Number of Circuits
    1
  • Product Status
    Active
  • Packaging
    Tube
The 2309NZ-1HDCG integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips offer high-speed operation and low power consumption, making them suitable for applications that require efficient processing. 2. Compact Size: The chips are designed to be compact, allowing for space-saving integration into various electronic devices. 3. Versatility: They can be used in a wide range of applications due to their flexible design and compatibility with different systems. 4. Robustness: The chips are built to withstand harsh environmental conditions, ensuring reliable operation even in challenging situations. 5. Cost-Effective: These chips provide a cost-effective solution for various electronic applications, making them suitable for mass production.Application Scenarios: 1. Consumer Electronics: The 2309NZ-1HDCG chips can be used in smartphones, tablets, and other portable devices to enhance their processing capabilities and improve power efficiency. 2. Automotive: These chips can be utilized in automotive systems such as infotainment systems, advanced driver-assistance systems (ADAS), and engine control units (ECUs) to enable efficient and reliable performance. 3. Industrial Automation: They can be employed in industrial automation systems for tasks like data processing, control, and communication, ensuring smooth operation and high productivity. 4. Internet of Things (IoT): The chips can be integrated into IoT devices, enabling efficient data processing and connectivity for various applications like smart homes, wearables, and industrial IoT. 5. Medical Devices: These chips can be used in medical devices such as patient monitoring systems, diagnostic equipment, and medical imaging devices to enable accurate and efficient data processing.Overall, the 2309NZ-1HDCG integrated circuit chips offer high performance, versatility, and robustness, making them suitable for a wide range of applications in consumer electronics, automotive, industrial automation, IoT, and medical devices.
2309NZ-1HDCG Relevant information