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SY56020RMG-TR

SY56020RMG-TR

Manufacturer No:

SY56020RMG-TR

Manufacturer:

Microchip Technology

Description:

IC CLK BUFFER 1:4 4.5GHZ 16MLF

Datasheet:

Datasheet

Delivery:

Payment:

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SY56020RMG-TR Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-MLF® (3x3)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    2.375V ~ 2.625V
  • Output
    CML
  • Differential - Input:Output
    Yes/Yes
  • Ratio - Input:Output
    1:4
  • Number of Circuits
    1
  • Product Status
    Active
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Series
    Precision Edge®
The SY56020RMG-TR is a specific integrated circuit chip designed for high-speed signal transmission and conditioning. Some of its advantages and application scenarios include:1. High-speed signal transmission: The SY56020RMG-TR chip is designed to handle high-speed signals, making it suitable for applications that require fast data transmission. It can support data rates up to several gigabits per second, making it ideal for high-speed communication systems.2. Signal conditioning: The chip provides signal conditioning capabilities, allowing it to improve the quality and integrity of signals. It can compensate for signal distortions, reduce noise, and enhance signal integrity, ensuring reliable data transmission.3. Low power consumption: The SY56020RMG-TR chip is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial. It helps in reducing overall power consumption and extending battery life.4. Small form factor: The chip is available in a small form factor, making it suitable for applications with space constraints. It can be easily integrated into compact electronic devices or systems where size is a critical factor.5. Communication systems: The SY56020RMG-TR chip finds applications in various communication systems, including high-speed data transmission, optical communication, networking equipment, and telecommunications. It can be used in devices such as routers, switches, optical transceivers, and high-speed data links.6. Data centers: With its high-speed signal transmission capabilities, the chip is well-suited for data center applications. It can be used in high-speed interconnects, server-to-server communication, and data storage systems, ensuring efficient and reliable data transfer within data centers.7. Test and measurement equipment: The chip can be used in test and measurement equipment that requires high-speed signal conditioning and transmission. It helps in accurately measuring and analyzing signals in applications such as oscilloscopes, network analyzers, and signal generators.Overall, the SY56020RMG-TR integrated circuit chip offers advantages such as high-speed signal transmission, signal conditioning capabilities, low power consumption, and a small form factor. Its application scenarios include communication systems, data centers, and test and measurement equipment.
SY56020RMG-TR Relevant information