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8737AG-11LF

8737AG-11LF

Manufacturer No:

8737AG-11LF

Description:

IC CLK BUFFER 2:2 650MHZ 20TSSOP

Datasheet:

Datasheet

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8737AG-11LF Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-TSSOP
  • Package / Case
    20-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Voltage - Supply
    3.135V ~ 3.465V
  • Differential - Input:Output
    Yes/Yes
  • Number of Circuits
    1
  • Product Status
    Obsolete
  • Packaging
    Tube
The 8737AG-11LF integrated circuit chips have several advantages and application scenarios:Advantages: 1. Low power consumption: These chips are designed to operate with low power requirements, making them suitable for battery-powered devices or energy-efficient applications. 2. High sensitivity: The chips have high sensitivity, enabling them to detect and process weak signals accurately. 3. Wide frequency range: They can operate over a wide frequency range, making them versatile for various wireless communication applications. 4. Compact size: The chips are small and compact, allowing for easy integration into different devices or systems. 5. Cost-effective: These chips offer a cost-effective solution for wireless communication needs, making them suitable for mass production and commercial applications.Application Scenarios: 1. Internet of Things (IoT): The 8737AG-11LF chips can be used in IoT devices for wireless connectivity, enabling communication between devices and data transmission to the cloud. 2. Wireless sensor networks: These chips can be utilized in wireless sensor networks for applications such as environmental monitoring, industrial automation, or smart agriculture. 3. Home automation: They can be integrated into home automation systems to enable wireless control and communication between various devices, such as smart lights, thermostats, or security systems. 4. Wearable devices: The chips can be used in wearable devices like fitness trackers, smartwatches, or healthcare monitoring devices, enabling wireless connectivity and data transmission. 5. Industrial applications: They can be employed in industrial applications for wireless communication between machines, remote monitoring, or control systems. 6. Smart cities: The chips can be utilized in smart city infrastructure for applications like smart lighting, parking management, or environmental monitoring.Overall, the 8737AG-11LF integrated circuit chips offer low power consumption, high sensitivity, and wide frequency range, making them suitable for various wireless communication applications in IoT, home automation, wearables, industrial settings, and smart cities.
8737AG-11LF Relevant information