Home / Clock Buffers, Drivers / MC10EP11DTG/
MC10EP11DTG

MC10EP11DTG

Manufacturer No:

MC10EP11DTG

Manufacturer:

onsemi

Description:

IC CLK BUFFER 1:2 3GHZ 8TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

MC10EP11DTG Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-TSSOP
  • Package / Case
    8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    3V ~ 5.5V
  • Output
    ECL, PECL
  • Differential - Input:Output
    Yes/Yes
  • Ratio - Input:Output
    1:2
  • Number of Circuits
    1
  • Product Status
    Active
  • Packaging
    Tube
  • Series
    10EP
The MC10EP11DTG is a high-speed differential receiver integrated circuit chip manufactured by ON Semiconductor. It is part of the ECLinPS MAX family of devices and offers several advantages and application scenarios:Advantages: 1. High-speed operation: The MC10EP11DTG is designed to operate at very high speeds, making it suitable for applications that require fast data transmission and processing. 2. Low jitter: It provides low jitter performance, ensuring accurate and reliable data reception. 3. Differential inputs: The chip has differential inputs, which allow for noise rejection and improved signal integrity. 4. Wide operating voltage range: It can operate within a wide voltage range, typically between -4.2V and -5.7V, making it compatible with various power supply configurations. 5. Small form factor: The chip comes in a small form factor package, making it suitable for space-constrained applications.Application scenarios: 1. High-speed data communication: The MC10EP11DTG can be used in high-speed data communication systems, such as optical networks, where fast and accurate data reception is crucial. 2. Clock and data recovery: It can be employed in clock and data recovery circuits, which are used to extract timing information and data from high-speed serial data streams. 3. Test and measurement equipment: The chip can be utilized in test and measurement equipment that requires high-speed signal reception and processing. 4. Data storage systems: It can be integrated into data storage systems, such as solid-state drives (SSDs), to handle high-speed data transfer between storage components. 5. High-speed digital signal processing: The MC10EP11DTG can be used in applications that involve high-speed digital signal processing, such as radar systems or high-performance computing.It is important to note that the specific application and implementation of the MC10EP11DTG may vary depending on the requirements and design considerations of the system in which it is used.
MC10EP11DTG Relevant information