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MC10LVEP11DTG

MC10LVEP11DTG

Manufacturer No:

MC10LVEP11DTG

Manufacturer:

onsemi

Description:

IC CLK BUFFER 1:2 3GHZ 8TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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MC10LVEP11DTG Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-TSSOP
  • Package / Case
    8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Output
    ECL, PECL
  • Differential - Input:Output
    Yes/Yes
  • Ratio - Input:Output
    1:2
  • Number of Circuits
    1
  • Product Status
    Active
  • Packaging
    Tube
The MC10LVEP11DTG is a specific integrated circuit chip designed by ON Semiconductor. It belongs to the ECLinPS MAX family of devices and offers several advantages and application scenarios. Here are some of them:Advantages: 1. High-speed operation: The MC10LVEP11DTG operates at very high speeds, making it suitable for applications that require fast data processing and transmission. 2. Low power consumption: It is designed to consume low power, making it energy-efficient and suitable for battery-powered devices or applications where power efficiency is crucial. 3. Differential signaling: The chip supports differential signaling, which provides better noise immunity and signal integrity, making it suitable for applications in noisy environments. 4. Wide operating voltage range: It can operate within a wide voltage range, allowing flexibility in various applications. 5. Small form factor: The chip comes in a small package, making it suitable for space-constrained applications.Application scenarios: 1. High-speed data communication: The MC10LVEP11DTG can be used in applications that require high-speed data transmission, such as telecommunications, networking, and data centers. 2. Clock and data distribution: It can be used in clock and data distribution systems where precise and synchronized signals are required, such as in high-performance computing or test and measurement equipment. 3. Signal conditioning: The chip can be used for signal conditioning and amplification in applications like high-speed data acquisition, radar systems, or high-frequency instrumentation. 4. Industrial automation: It can be utilized in industrial automation systems that require fast and reliable data processing, such as robotics, motion control, or machine vision. 5. Test and measurement: The chip can be used in test and measurement equipment that requires high-speed signal generation, acquisition, or analysis.These are just a few examples of the advantages and application scenarios of the MC10LVEP11DTG integrated circuit chip. The specific usage will depend on the requirements and design considerations of the target application.
MC10LVEP11DTG Relevant information