MC10EP11DR2G

MC10EP11DR2G

Manufacturer No:

MC10EP11DR2G

Manufacturer:

onsemi

Description:

IC CLK BUFFER 1:2 3GHZ 8SOIC

Datasheet:

Datasheet

Delivery:

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MC10EP11DR2G Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    3V ~ 5.5V
  • Output
    ECL, PECL
  • Differential - Input:Output
    Yes/Yes
  • Ratio - Input:Output
    1:2
  • Number of Circuits
    1
  • Product Status
    Active
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Series
    10EP
The MC10EP11DR2G is a high-speed differential receiver integrated circuit chip manufactured by ON Semiconductor. It is part of the ECLinPS MAX family of devices and offers several advantages and application scenarios:Advantages: 1. High-speed operation: The MC10EP11DR2G is designed to operate at very high speeds, making it suitable for applications that require fast data transmission and processing. 2. Low power consumption: It has low power dissipation, making it energy-efficient and suitable for battery-powered devices or applications where power consumption is a concern. 3. Differential signaling: The chip uses differential signaling, which provides better noise immunity and common-mode rejection, resulting in improved signal integrity and reliability. 4. Wide operating voltage range: It can operate over a wide voltage range, typically from -4.2V to -5.7V, allowing flexibility in different power supply configurations.Application scenarios: 1. High-speed data communication: The MC10EP11DR2G can be used in applications that require high-speed data transmission, such as fiber-optic communication systems, high-speed networking equipment, and data centers. 2. Clock and data recovery: It can be used in clock and data recovery circuits, where it receives and synchronizes data signals with a clock signal, ensuring accurate data retrieval and synchronization. 3. Test and measurement equipment: The chip can be used in high-speed test and measurement equipment, such as oscilloscopes and logic analyzers, to capture and analyze high-speed digital signals. 4. Industrial automation: It can be used in industrial automation systems that require high-speed data processing and communication, such as programmable logic controllers (PLCs) and motion control systems. 5. Radar and sonar systems: The MC10EP11DR2G can be used in radar and sonar systems that require high-speed signal processing and data acquisition for target detection and tracking.It is important to note that the specific application scenarios may vary depending on the system requirements and design considerations.