MC100LVEP11DR2G

MC100LVEP11DR2G

Manufacturer No:

MC100LVEP11DR2G

Manufacturer:

onsemi

Description:

IC CLK BUFFER 1:2 3GHZ 8SOIC

Datasheet:

Datasheet

Delivery:

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MC100LVEP11DR2G Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Output
    ECL, PECL
  • Differential - Input:Output
    Yes/Yes
  • Ratio - Input:Output
    1:2
  • Number of Circuits
    1
  • Product Status
    Active
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Series
    100LVEP
The MC100LVEP11DR2G is a high-speed differential receiver integrated circuit chip. Some of its advantages and application scenarios include:1. High-speed operation: The MC100LVEP11DR2G is designed to operate at very high speeds, making it suitable for applications that require fast data transmission and processing.2. Low voltage differential signaling (LVDS): This chip uses LVDS technology, which allows for high-speed data transmission with low power consumption. LVDS is commonly used in applications such as high-speed data communication, video transmission, and clock distribution.3. Differential signaling: The chip uses differential signaling, which provides better noise immunity and signal integrity compared to single-ended signaling. This makes it suitable for applications in noisy environments or where long-distance transmission is required.4. Wide operating voltage range: The MC100LVEP11DR2G can operate over a wide voltage range, typically from -3.0V to -5.5V. This flexibility in voltage range allows for compatibility with different system requirements.5. Clock and data recovery: The chip can be used for clock and data recovery in high-speed communication systems. It can extract the clock signal from the incoming data stream, ensuring accurate synchronization and reliable data transmission.6. Networking and telecommunications: The MC100LVEP11DR2G is commonly used in networking and telecommunications applications, such as routers, switches, and high-speed data links. It enables high-speed data transmission and synchronization in these systems.7. Test and measurement equipment: The chip can be used in test and measurement equipment that requires high-speed data acquisition and processing. It helps in capturing and analyzing high-frequency signals accurately.8. Industrial automation: The MC100LVEP11DR2G can be used in industrial automation systems that require high-speed data communication and control. It enables reliable and fast data transmission between different components of the automation system.Overall, the MC100LVEP11DR2G integrated circuit chip offers high-speed, low-power, and reliable data transmission capabilities, making it suitable for various applications in networking, telecommunications, test and measurement, and industrial automation.