CDC3RL02YFPR

CDC3RL02YFPR

Manufacturer No:

CDC3RL02YFPR

Manufacturer:

Texas Instruments

Description:

IC CLK BUFFER 1:2 52MHZ 8DSBGA

Datasheet:

Datasheet

Delivery:

Payment:

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CDC3RL02YFPR Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-DSBGA
  • Package / Case
    8-XFBGA, DSBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    2.3V ~ 5.5V
  • Differential - Input:Output
    No/No
  • Ratio - Input:Output
    1:2
  • Number of Circuits
    1
  • Product Status
    Active
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
The CDC3RL02YFPR is a specific model of integrated circuit chip, and without detailed information about its specifications and features, it is difficult to provide specific advantages and application scenarios. However, in general, integrated circuit chips offer several advantages:1. Miniaturization: Integrated circuit chips are small in size and can pack a large number of electronic components onto a single chip, enabling miniaturization of electronic devices.2. Cost-effective: Integrated circuit chips can be mass-produced, leading to economies of scale and reduced manufacturing costs.3. Power efficiency: Integrated circuit chips are designed to be power-efficient, helping to extend the battery life of portable devices.4. Reliability: Integrated circuit chips are less prone to failure compared to discrete electronic components, as they are manufactured using automated processes and undergo rigorous testing.5. Versatility: Integrated circuit chips can be designed for various applications, including microprocessors, memory chips, sensors, and communication devices.Regarding the application scenarios of the CDC3RL02YFPR chip, it would be necessary to refer to the datasheet or technical documentation provided by the manufacturer. This documentation typically outlines the specific features, functions, and recommended applications of the chip.