CDC3RL02YFPR
Manufacturer No:
CDC3RL02YFPR
Manufacturer:
Description:
IC CLK BUFFER 1:2 52MHZ 8DSBGA
Datasheet:
Delivery:
Payment:
In Stock : 10369
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CDC3RL02YFPR Specifications
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TypeParameter
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Supplier Device Package8-DSBGA
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Package / Case8-XFBGA, DSBGA
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C
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Voltage - Supply2.3V ~ 5.5V
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Differential - Input:OutputNo/No
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Ratio - Input:Output1:2
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Number of Circuits1
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Product StatusActive
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
The CDC3RL02YFPR is a specific model of integrated circuit chip, and without detailed information about its specifications and features, it is difficult to provide specific advantages and application scenarios. However, in general, integrated circuit chips offer several advantages:1. Miniaturization: Integrated circuit chips are small in size and can pack a large number of electronic components onto a single chip, enabling miniaturization of electronic devices.2. Cost-effective: Integrated circuit chips can be mass-produced, leading to economies of scale and reduced manufacturing costs.3. Power efficiency: Integrated circuit chips are designed to be power-efficient, helping to extend the battery life of portable devices.4. Reliability: Integrated circuit chips are less prone to failure compared to discrete electronic components, as they are manufactured using automated processes and undergo rigorous testing.5. Versatility: Integrated circuit chips can be designed for various applications, including microprocessors, memory chips, sensors, and communication devices.Regarding the application scenarios of the CDC3RL02YFPR chip, it would be necessary to refer to the datasheet or technical documentation provided by the manufacturer. This documentation typically outlines the specific features, functions, and recommended applications of the chip.
CDC3RL02YFPR Relevant information