SY89311UMG-TR

SY89311UMG-TR

Manufacturer No:

SY89311UMG-TR

Manufacturer:

Microchip Technology

Description:

IC CLK BUFFER 1:2 3GHZ 8MLF

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

SY89311UMG-TR Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-MLF® (2x2)
  • Package / Case
    8-VFDFN Exposed Pad, 8-MLF®
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Output
    ECL, PECL
  • Differential - Input:Output
    Yes/Yes
  • Ratio - Input:Output
    1:2
  • Number of Circuits
    1
  • Product Status
    Active
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Series
    Precision Edge®
The SY89311UMG-TR is a specific integrated circuit chip designed for high-speed data transmission applications. Some of its advantages and application scenarios include:1. High-speed data transmission: The SY89311UMG-TR chip is designed to operate at very high data rates, typically up to 3.2 Gbps. This makes it suitable for applications that require fast and reliable data transmission, such as high-speed networking, telecommunications, and data centers.2. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial.3. Small form factor: The SY89311UMG-TR chip is available in a small form factor package, making it suitable for space-constrained applications or devices where miniaturization is important.4. Differential signaling: The chip supports differential signaling, which helps in reducing noise and improving signal integrity. This makes it suitable for applications that require high signal quality, such as high-speed data transmission over long distances or in noisy environments.5. Wide operating temperature range: The chip is designed to operate over a wide temperature range, typically from -40°C to +85°C. This makes it suitable for applications that require operation in extreme temperature conditions.Some application scenarios where the SY89311UMG-TR chip can be used include:1. High-speed networking: The chip can be used in networking equipment, such as routers, switches, and optical transceivers, to enable high-speed data transmission between devices.2. Telecommunications: The chip can be used in telecommunications equipment, such as base stations or communication modules, to enable high-speed data transmission over long distances.3. Data centers: The chip can be used in data center equipment, such as servers or storage devices, to enable fast and reliable data transmission between different components.4. Industrial automation: The chip can be used in industrial automation applications, such as control systems or robotics, to enable high-speed data communication between different devices or modules.5. Automotive electronics: The chip can be used in automotive electronics applications, such as infotainment systems or advanced driver-assistance systems (ADAS), to enable high-speed data transmission between different components or sensors.Overall, the SY89311UMG-TR chip offers high-speed data transmission, low power consumption, small form factor, and wide temperature range, making it suitable for various applications that require fast and reliable data communication.