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BU2373FV-E2

BU2373FV-E2

Manufacturer No:

BU2373FV-E2

Manufacturer:

Description:

IC HI PERFORMANCE VCO SSOP-B14

Datasheet:

Datasheet

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BU2373FV-E2 Specifications

  • Type
    Parameter
  • Package / Case
    14-LSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -20°C ~ 75°C
  • Voltage - Supply
    3V ~ 5V
  • Differential - Input:Output
    No/No
  • Ratio - Input:Output
    1:1
  • Number of Circuits
    1
  • PLL
    Yes
  • DigiKey Programmable
    Not Verified
  • Product Status
    Obsolete
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Series
    -
The BU2373FV-E2 is an integrated circuit chip designed for audio applications. Some of its advantages and application scenarios include:1. High-quality audio performance: The chip offers excellent audio quality with low distortion and noise, making it suitable for various audio applications.2. Compact size: The chip is designed to be compact, allowing for easy integration into small electronic devices or systems.3. Low power consumption: The BU2373FV-E2 chip is designed to operate with low power consumption, making it suitable for battery-powered devices or energy-efficient applications.4. Wide operating voltage range: The chip can operate within a wide voltage range, making it compatible with different power supply configurations.5. Multiple input/output options: The chip provides multiple input and output options, allowing for flexibility in connecting to different audio sources and devices.6. Application scenarios: The BU2373FV-E2 chip can be used in various audio applications, including portable audio devices, headphones, speakers, audio amplifiers, and automotive audio systems.Overall, the advantages and application scenarios of the BU2373FV-E2 integrated circuit chips make it a suitable choice for audio applications that require high-quality audio performance, compact size, low power consumption, and flexibility in connectivity.
BU2373FV-E2 Relevant information