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MC88916EG80R2

MC88916EG80R2

Manufacturer No:

MC88916EG80R2

Description:

IC CLK BUF CISC 80MHZ 1CIRC

Datasheet:

Datasheet

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MC88916EG80R2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-SOIC
  • Package / Case
    20-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    4.5V ~ 5.5V
  • Differential - Input:Output
    No/Yes
  • Number of Circuits
    1
  • Output
    CMOS
  • PLL
    Yes
  • DigiKey Programmable
    Not Verified
  • Product Status
    Active
  • Packaging
    Tape & Reel (TR)
  • Series
    -
The MC88916EG80R2 is a specific model of integrated circuit (IC) chip manufactured by Freescale Semiconductor (now NXP Semiconductors). It is a member of the MC88900 series of integrated circuits, which are designed for use in various communication applications. While specific advantages and application scenarios may vary depending on the exact requirements and use cases, here are some general advantages and application scenarios of the MC88916EG80R2:Advantages: 1. High Performance: The MC88916EG80R2 is designed to deliver high-performance communication capabilities, making it suitable for demanding applications. 2. Integrated Features: The chip integrates various features and functions, reducing the need for external components and simplifying the overall system design. 3. Low Power Consumption: The MC88916EG80R2 is designed to operate with low power consumption, making it suitable for battery-powered devices or energy-efficient applications. 4. Robust Communication Protocols: The chip supports various communication protocols, such as HDLC (High-Level Data Link Control) and SDLC (Synchronous Data Link Control), enabling reliable and efficient data transmission. 5. Flexible Configuration: The chip offers flexible configuration options, allowing users to customize its behavior and adapt it to specific application requirements.Application Scenarios: 1. Industrial Automation: The MC88916EG80R2 can be used in industrial automation systems for communication between different devices, such as programmable logic controllers (PLCs), sensors, and actuators. 2. Networking Equipment: The chip can be utilized in networking equipment, such as routers, switches, and gateways, to enable reliable and efficient data communication between different network nodes. 3. Smart Grid Systems: The MC88916EG80R2 can be employed in smart grid systems for communication between various components, such as smart meters, substations, and control centers, facilitating efficient energy management and monitoring. 4. Transportation Systems: The chip can be integrated into transportation systems, such as railway signaling systems or traffic control systems, to enable reliable and secure communication between different subsystems. 5. Medical Devices: The MC88916EG80R2 can be used in medical devices, such as patient monitoring systems or medical imaging equipment, for data transmission and communication between different components.It's important to note that the specific advantages and application scenarios may vary depending on the system requirements and the overall design considerations. It is recommended to refer to the datasheet and technical documentation provided by the manufacturer for detailed information and specific use cases.
MC88916EG80R2 Relevant information