Home / Microcontrollers / C8051F550-IM/
C8051F550-IM

C8051F550-IM

Manufacturer No:

C8051F550-IM

Manufacturer:

Silicon Labs

Description:

IC MCU 8BIT 32KB FLASH 24QFN

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

C8051F550-IM Specifications

  • Type
    Parameter
  • Supplier Device Package
    24-QFN (4x4)
  • Package / Case
    24-WFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 18x12b
  • Voltage - Supply (Vcc/Vdd)
    1.8V ~ 5.25V
  • RAM Size
    2.25K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    32KB (32K x 8)
  • Number of I/O
    18
  • Peripherals
    POR, PWM, Temp Sensor, WDT
  • Connectivity
    SMBus (2-Wire/I²C), CANbus, LINbus, SPI, UART/USART
  • Speed
    50MHz
  • Core Size
    8-Bit
  • Core Processor
    8051
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    C8051F55x
The C8051F550-IM integrated circuit (IC) chips, developed by Silicon Labs, offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of these chips are:Advantages: 1. High Performance: The C8051F550-IM chips are based on a high-performance 8051 core, providing fast execution and efficient processing capabilities. 2. Integrated Peripherals: These chips come with a wide range of integrated peripherals, including analog-to-digital converters (ADCs), digital-to-analog converters (DACs), timers, UARTs, SPI, I2C, and more. This integration reduces the need for external components and simplifies the design process. 3. Low Power Consumption: The C8051F550-IM chips are designed to operate at low power, making them suitable for battery-powered applications or devices that require energy efficiency. 4. Small Form Factor: These chips are available in small form factors, such as QFN packages, which are ideal for space-constrained applications.Application Scenarios: 1. Internet of Things (IoT) Devices: The C8051F550-IM chips can be used in IoT devices that require low power consumption, small size, and integrated peripherals. These chips can enable connectivity, sensor interfacing, and data processing in IoT applications. 2. Industrial Automation: With their high-performance capabilities and integrated peripherals, these chips can be applied in industrial automation systems. They can control and monitor various processes, communicate with other devices, and perform data acquisition and analysis. 3. Consumer Electronics: The C8051F550-IM chips can be used in consumer electronics products, such as smart home devices, wearable devices, and portable gadgets. Their low power consumption and small form factor make them suitable for these applications. 4. Medical Devices: These chips can be utilized in medical devices, such as patient monitoring systems, medical instruments, and diagnostic equipment. Their integrated peripherals and high-performance capabilities enable accurate data acquisition, processing, and communication. 5. Automotive Electronics: The C8051F550-IM chips can be applied in automotive electronics, including vehicle control systems, infotainment systems, and advanced driver-assistance systems (ADAS). Their small form factor, low power consumption, and integrated peripherals make them suitable for automotive applications.Overall, the C8051F550-IM integrated circuit chips offer a combination of high performance, low power consumption, integrated peripherals, and small form factor, making them versatile for various applications in different industries.
C8051F550-IM Relevant information