Home / Microcontrollers / XE216-512-FB236-C20/
XE216-512-FB236-C20

XE216-512-FB236-C20

Manufacturer No:

XE216-512-FB236-C20

Manufacturer:

XMOS

Description:

IC MCU 32BIT ROMLESS 236FBGA

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

XE216-512-FB236-C20 Specifications

  • Type
    Parameter
  • Supplier Device Package
    236-FBGA (10x10)
  • Package / Case
    236-LFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Oscillator Type
    External
  • Data Converters
    -
  • Voltage - Supply (Vcc/Vdd)
    0.95V ~ 3.6V
  • RAM Size
    512K x 8
  • EEPROM Size
    -
  • Program Memory Type
    ROMless
  • Program Memory Size
    -
  • Number of I/O
    73
  • Peripherals
    -
  • Connectivity
    RGMII, USB
  • Speed
    2000MIPS
  • Core Size
    32-Bit 16-Core
  • Core Processor
    XCore
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    XE
The XE216-512-FB236-C20 integrated circuit (IC) chip is a high-performance multicore digital signal processor (DSP) designed by XMOS. It offers several advantages and can be applied in various scenarios. Here are some of the advantages and application scenarios of the XE216-512-FB236-C20 IC chips:Advantages: 1. Multicore Architecture: The XE216-512-FB236-C20 chip features a multicore architecture with up to 16 real-time cores. This allows for parallel processing and efficient execution of complex algorithms, making it suitable for demanding applications.2. High Performance: With a clock speed of up to 700 MHz and advanced DSP capabilities, the XE216-512-FB236-C20 chip delivers high-performance processing power. It can handle real-time audio, video, and other signal processing tasks with low latency.3. Flexible I/O: The chip provides a wide range of I/O options, including USB, Ethernet, I2C, SPI, and GPIO. This flexibility enables seamless integration with various peripherals and interfaces, making it adaptable to different application requirements.4. Low Power Consumption: Despite its high performance, the XE216-512-FB236-C20 chip is designed to be power-efficient. It incorporates power management features that optimize power consumption, making it suitable for battery-powered or energy-efficient devices.Application Scenarios: 1. Audio Processing: The XE216-512-FB236-C20 chip is well-suited for audio processing applications such as audio effects, audio mixing, noise cancellation, and audio recognition. Its multicore architecture and DSP capabilities enable real-time audio processing with low latency.2. Industrial Automation: With its high-performance processing capabilities, the XE216-512-FB236-C20 chip can be used in industrial automation applications. It can handle real-time control, data acquisition, and signal processing tasks required in industrial environments.3. Robotics: The chip's multicore architecture and advanced DSP capabilities make it suitable for robotics applications. It can handle complex algorithms for robot control, sensor fusion, computer vision, and machine learning tasks.4. IoT Devices: The XE216-512-FB236-C20 chip's low power consumption and flexible I/O options make it suitable for Internet of Things (IoT) devices. It can be used in smart home devices, wearables, sensor nodes, and other IoT applications that require real-time signal processing.5. Automotive: The chip's high-performance processing power and low latency make it suitable for automotive applications. It can be used in advanced driver assistance systems (ADAS), in-vehicle infotainment systems, and other automotive electronics that require real-time signal processing.Overall, the XE216-512-FB236-C20 integrated circuit chips offer high-performance signal processing capabilities, making them suitable for a wide range of applications in audio processing, industrial automation, robotics, IoT devices, and automotive electronics.
XE216-512-FB236-C20 Relevant information