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LPC3143FET180,551

LPC3143FET180,551

Manufacturer No:

LPC3143FET180,551

Manufacturer:

NXP USA Inc.

Description:

IC MCU 16/32BIT ROMLESS 180TFBGA

Datasheet:

Datasheet

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LPC3143FET180,551 Specifications

  • Type
    Parameter
  • Supplier Device Package
    180-TFBGA (12x12)
  • Package / Case
    180-TFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    External
  • Data Converters
    A/D 4x10b
  • Voltage - Supply (Vcc/Vdd)
    1.1V ~ 3.6V
  • RAM Size
    192K x 8
  • EEPROM Size
    -
  • Program Memory Type
    ROMless
  • Program Memory Size
    -
  • Number of I/O
    20
  • Peripherals
    DMA, I²S, LCD, PWM, WDT
  • Connectivity
    EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
  • Speed
    270MHz
  • Core Size
    16/32-Bit
  • Core Processor
    ARM926EJ-S
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    LPC3100
The LPC3143FET180,551 is a specific model of the LPC3143 microcontroller integrated circuit chip manufactured by NXP Semiconductors. Here are some advantages and application scenarios for this chip:Advantages: 1. High Performance: The LPC3143FET180,551 is based on the ARM Cortex-M3 core, which provides a high-performance architecture for efficient processing and execution of instructions. 2. Wide Operating Voltage Range: This chip supports an operating voltage range of 1.8V to 5.5V, making it suitable for various low-power and portable applications. 3. Rich Connectivity: The LPC3143FET180,551 offers various communication interfaces like USB, UART, SPI, and I2C, allowing seamless integration with other devices and peripherals. 4. On-chip Memory: It has a generous amount of on-chip Flash memory (up to 256KB) and RAM (up to 36KB), enabling the implementation of complex and feature-rich applications. 5. Low Power Consumption: The LPC3143FET180,551 is designed for low power consumption, making it suitable for battery-powered applications where energy efficiency is critical.Application Scenarios: 1. Embedded Systems: The LPC3143FET180,551 is commonly used in embedded systems that require a combination of processing power, connectivity, and low-power operation. It can be employed in applications like industrial control systems, home automation, smart appliances, etc. 2. Internet of Things (IoT): With its wide range of communication interfaces, this chip is suitable for IoT devices that need to connect to the internet and exchange data with other devices or cloud platforms. 3. HMI and User Interface Devices: The LPC3143FET180,551 can be utilized in devices that require a graphical user interface (GUI), such as touchscreens, control panels, HMIs, and IoT gateways. 4. Consumer Electronics: Due to its high performance and low power consumption, it can be applied in various consumer electronics devices, including wearables, gaming consoles, remote controls, and multimedia players.It is important to note that the specific use cases and scenarios may vary based on the requirements of the target application.
LPC3143FET180,551 Relevant information