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LPC1345FHN33,551

LPC1345FHN33,551

Manufacturer No:

LPC1345FHN33,551

Manufacturer:

NXP USA Inc.

Description:

IC MCU 32BIT 32KB FLASH 32HVQFN

Datasheet:

Datasheet

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LPC1345FHN33,551 Specifications

  • Type
    Parameter
  • Supplier Device Package
    32-HVQFN (7x7)
  • Package / Case
    32-VQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 8x12b
  • Voltage - Supply (Vcc/Vdd)
    2V ~ 3.6V
  • RAM Size
    10K x 8
  • EEPROM Size
    2K x 8
  • Program Memory Type
    FLASH
  • Program Memory Size
    32KB (32K x 8)
  • Number of I/O
    26
  • Peripherals
    Brown-out Detect/Reset, POR, WDT
  • Connectivity
    I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
  • Speed
    72MHz
  • Core Size
    32-Bit Single-Core
  • Core Processor
    ARM® Cortex®-M3
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    LPC13xx
The LPC1345FHN33,551 is a microcontroller chip from NXP Semiconductors. It belongs to the LPC13xx series and offers several advantages and application scenarios. Here are some of them:Advantages: 1. Low Power Consumption: The LPC1345FHN33,551 is designed to operate at low power, making it suitable for battery-powered applications or devices that require energy efficiency. 2. High Performance: Despite its low power consumption, the chip offers a high-performance ARM Cortex-M3 core, enabling it to handle complex tasks and applications. 3. Integrated Peripherals: The chip includes various integrated peripherals such as UART, SPI, I2C, GPIO, ADC, and timers, which provide flexibility and reduce the need for external components. 4. Small Form Factor: The LPC1345FHN33,551 comes in a small form factor package, making it suitable for space-constrained applications or designs where size is a critical factor. 5. Cost-Effective: The chip offers a balance between performance and cost, making it an affordable choice for many applications.Application Scenarios: 1. Internet of Things (IoT) Devices: The LPC1345FHN33,551 is suitable for IoT applications due to its low power consumption, integrated peripherals, and small form factor. It can be used in smart home devices, wearable technology, sensor nodes, and other IoT applications. 2. Industrial Automation: The chip's high-performance capabilities and integrated peripherals make it suitable for industrial automation applications. It can be used in motor control, robotics, process control, and other industrial automation systems. 3. Consumer Electronics: The LPC1345FHN33,551 can be used in various consumer electronics applications such as smart appliances, remote controls, gaming devices, and audio systems. 4. Medical Devices: The low power consumption and small form factor of the chip make it suitable for medical devices that require portability and long battery life. It can be used in wearable health monitors, medical sensors, and portable medical equipment. 5. Automotive Electronics: The chip's high-performance ARM Cortex-M3 core and integrated peripherals make it suitable for automotive applications. It can be used in automotive control systems, infotainment systems, and vehicle diagnostics.These are just a few examples of the advantages and application scenarios of the LPC1345FHN33,551 chip. Its versatility, low power consumption, and integrated peripherals make it suitable for a wide range of applications in various industries.
LPC1345FHN33,551 Relevant information