DSPIC30F1010-20E/MM
Manufacturer No:
DSPIC30F1010-20E/MM
Manufacturer:
Description:
IC MCU 16BIT 6KB FLASH 28QFN
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In Stock : 35
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DSPIC30F1010-20E/MM Specifications
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TypeParameter
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Supplier Device Package28-QFN-S (6x6)
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Package / Case28-VQFN Exposed Pad
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 125°C (TA)
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Oscillator TypeInternal
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Data ConvertersA/D 6x10b
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Voltage - Supply (Vcc/Vdd)3V ~ 5.5V
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RAM Size256 x 8
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EEPROM Size-
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Program Memory TypeFLASH
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Program Memory Size6KB (2K x 24)
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Number of I/O21
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PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
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ConnectivityI²C, IrDA, LINbus, SPI, UART/USART
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Speed20 MIPS
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Core Size16-Bit
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Core ProcessordsPIC
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DigiKey ProgrammableNot Verified
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PackagingTube
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Product StatusActive
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SeriesdsPIC™ 30F
The DSPIC30F1010-20E/MM integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-performance Digital Signal Processor (DSP): The DSPIC30F1010-20E/MM chips are equipped with a powerful DSP core, allowing for efficient and fast signal processing tasks. 2. Enhanced Peripheral Integration: These chips offer a wide range of integrated peripherals such as analog-to-digital converters (ADCs), digital-to-analog converters (DACs), timers, and communication interfaces, reducing the need for external components. 3. Low Power Consumption: The DSPIC30F1010-20E/MM chips are designed to operate at low power, making them suitable for battery-powered applications or energy-efficient systems. 4. Flexible and Scalable: These chips provide flexibility in terms of programming and can be easily scaled up or down to meet the requirements of different applications.Application Scenarios: 1. Motor Control: The DSPIC30F1010-20E/MM chips are commonly used in motor control applications, such as controlling the speed and direction of motors in robotics, industrial automation, and electric vehicles. 2. Power Electronics: These chips find applications in power electronics systems, including inverters, power supplies, and renewable energy systems, where they can perform tasks like power factor correction and voltage regulation. 3. Audio Processing: The DSP capabilities of these chips make them suitable for audio processing applications, such as audio effects, equalizers, and audio synthesis. 4. Communication Systems: The integrated communication interfaces in the DSPIC30F1010-20E/MM chips enable their use in communication systems, including wireless communication, data acquisition, and networking. 5. Medical Devices: These chips can be utilized in medical devices like patient monitoring systems, medical imaging, and diagnostic equipment, where real-time signal processing is required.Overall, the DSPIC30F1010-20E/MM integrated circuit chips offer high-performance DSP capabilities, integrated peripherals, low power consumption, and flexibility, making them suitable for a wide range of applications in various industries.
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