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DSPIC33FJ32GP102-I/ML

DSPIC33FJ32GP102-I/ML

Manufacturer No:

DSPIC33FJ32GP102-I/ML

Manufacturer:

Microchip Technology

Description:

IC MCU 16BIT 32KB FLASH 28QFN

Datasheet:

Datasheet

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DSPIC33FJ32GP102-I/ML Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-QFN (6x6)
  • Package / Case
    28-VQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 8x10b
  • Voltage - Supply (Vcc/Vdd)
    3V ~ 3.6V
  • RAM Size
    1K x 16
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    32KB (11K x 24)
  • Number of I/O
    21
  • Peripherals
    Brown-out Detect/Reset, POR, PWM, WDT
  • Connectivity
    I²C, IrDA, LINbus, SPI, UART/USART
  • Speed
    16 MIPs
  • Core Size
    16-Bit
  • Core Processor
    dsPIC
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    dsPIC™ 33F
The DSPIC33FJ32GP102-I/ML integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are based on the dsPIC33F core, which offers high performance and efficient execution of complex algorithms. 2. Digital Signal Processing (DSP) Capabilities: The chips have built-in DSP instructions and peripherals, making them suitable for applications that require real-time signal processing. 3. Enhanced Connectivity: They feature multiple communication interfaces such as UART, SPI, I2C, and CAN, enabling seamless connectivity with other devices. 4. Rich Peripherals: The chips come with various peripherals like timers, PWM modules, ADCs, and DACs, providing flexibility for different application requirements. 5. Low Power Consumption: They are designed to operate at low power, making them suitable for battery-powered applications. 6. Robustness and Reliability: These chips are designed to withstand harsh environments and offer high reliability.Application Scenarios: 1. Motor Control: The DSPIC33FJ32GP102-I/ML chips are commonly used in motor control applications, such as industrial automation, robotics, and electric vehicles. Their high-performance DSP capabilities and rich peripherals make them suitable for precise motor control algorithms. 2. Power Electronics: These chips can be used in power electronics applications like inverters, power supplies, and energy management systems. Their high-performance DSP capabilities and communication interfaces enable efficient control and monitoring of power electronics systems. 3. Audio Processing: The chips can be utilized in audio processing applications, such as audio effects processors, audio amplifiers, and digital audio mixers. Their DSP capabilities and peripherals like ADCs and DACs enable real-time audio signal processing. 4. Communication Systems: The chips can be employed in communication systems like wireless sensor networks, IoT devices, and data loggers. Their communication interfaces and low power consumption make them suitable for data transmission and connectivity. 5. Medical Devices: These chips can be used in medical devices like patient monitoring systems, medical imaging equipment, and diagnostic devices. Their high-performance DSP capabilities and robustness make them suitable for real-time signal processing and data analysis in medical applications.Overall, the DSPIC33FJ32GP102-I/ML integrated circuit chips offer high performance, DSP capabilities, and rich peripherals, making them suitable for a wide range of applications requiring real-time signal processing and control.
DSPIC33FJ32GP102-I/ML Relevant information