9DB106BFLF

9DB106BFLF

Manufacturer No:

9DB106BFLF

Description:

IC BUFFER 6OUTPUT PCI 28-SSOP

Datasheet:

Datasheet

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9DB106BFLF Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-SSOP
  • Package / Case
    28-SSOP (0.209", 5.30mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Voltage - Supply
    3.135V ~ 3.465V
  • Differential - Input:Output
    Yes/Yes
  • Number of Circuits
    1
  • Output
    HCSL
  • PLL
    Yes
  • DigiKey Programmable
    Not Verified
  • Product Status
    Obsolete
  • Packaging
    Tube
  • Series
    -
The 9DB106BFLF integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips offer high-speed data transmission and low power consumption, making them suitable for applications requiring fast and efficient data processing. 2. Compact Size: The chips are designed to be small and compact, making them suitable for space-constrained applications. 3. Versatility: The chips can be used in a wide range of applications, including telecommunications, networking, and data centers. 4. Reliability: These chips are designed to be highly reliable, ensuring stable and consistent performance over time. 5. Cost-Effective: The chips offer a cost-effective solution for various applications, providing value for money.Application Scenarios: 1. Telecommunications: The 9DB106BFLF chips can be used in telecommunications equipment such as routers, switches, and modems to enable high-speed data transmission and efficient network connectivity. 2. Networking: These chips can be utilized in networking devices like network interface cards (NICs) and Ethernet switches to enhance data processing capabilities and improve network performance. 3. Data Centers: The chips can be employed in data center equipment like servers and storage devices to enable fast and reliable data processing, ensuring efficient data management and storage. 4. Industrial Automation: These chips can be used in industrial automation systems to enable high-speed data communication between various components, enhancing overall system performance and efficiency. 5. Internet of Things (IoT): The chips can be utilized in IoT devices to enable seamless connectivity and efficient data processing, facilitating the exchange of information between devices and the cloud.Overall, the 9DB106BFLF integrated circuit chips offer high performance, compact size, versatility, reliability, and cost-effectiveness, making them suitable for various applications in telecommunications, networking, data centers, industrial automation, and IoT.