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MC9S12XEP100CAG

MC9S12XEP100CAG

Manufacturer No:

MC9S12XEP100CAG

Manufacturer:

NXP USA Inc.

Description:

IC MCU 16BIT 1MB FLASH 144LQFP

Datasheet:

Datasheet

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MC9S12XEP100CAG Specifications

  • Type
    Parameter
  • DigiKey Programmable
    Not Verified
  • Supplier Device Package
    144-LQFP (20x20)
  • Package / Case
    144-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    External
  • Data Converters
    A/D 24x12b
  • Voltage - Supply (Vcc/Vdd)
    1.72V ~ 5.5V
  • RAM Size
    64K x 8
  • EEPROM Size
    4K x 8
  • Program Memory Type
    FLASH
  • Program Memory Size
    1MB (1M x 8)
  • Number of I/O
    119
  • Peripherals
    LVD, POR, PWM, WDT
  • Connectivity
    CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
  • Speed
    50MHz
  • Core Size
    16-Bit
  • Core Processor
    HCS12X
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    HCS12X
The MC9S12XEP100CAG is a microcontroller integrated circuit chip developed by NXP Semiconductors. It belongs to the S12X family of microcontrollers and offers several advantages and application scenarios. Some of them are:1. High Performance: The MC9S12XEP100CAG chip is built on a 16-bit S12X CPU core, which provides high performance and processing capabilities. It operates at a clock frequency of up to 50 MHz, enabling it to handle complex tasks efficiently.2. Ample Memory: This chip offers a generous amount of memory, including 1 MB of flash memory for program storage and 96 KB of RAM for data storage. The large memory capacity allows for the implementation of complex algorithms and the storage of significant amounts of data.3. Enhanced Connectivity: The MC9S12XEP100CAG chip supports various communication interfaces, including CAN (Controller Area Network), LIN (Local Interconnect Network), and SCI (Serial Communication Interface). These interfaces enable seamless connectivity with other devices and systems, making it suitable for applications requiring communication capabilities.4. Rich Peripherals: The chip incorporates a wide range of peripherals, such as timers, PWM (Pulse Width Modulation) modules, ADC (Analog-to-Digital Converter), and SPI (Serial Peripheral Interface). These peripherals enhance the chip's versatility and make it suitable for applications that require precise timing, analog signal processing, or communication with external devices.5. Automotive Applications: The MC9S12XEP100CAG chip is specifically designed for automotive applications. It meets the stringent requirements of the automotive industry, including temperature range, electromagnetic compatibility, and reliability. It can be used in various automotive systems, such as engine control units, body control modules, and instrument clusters.6. Industrial Control: The high performance and rich peripheral set of the MC9S12XEP100CAG chip make it suitable for industrial control applications. It can be used in systems that require precise control, data acquisition, and communication with other industrial devices.7. Consumer Electronics: The chip's capabilities also make it suitable for consumer electronics applications. It can be used in devices that require advanced processing, connectivity, and control, such as home automation systems, smart appliances, and multimedia devices.Overall, the MC9S12XEP100CAG chip offers high performance, ample memory, enhanced connectivity, and a rich set of peripherals, making it suitable for a wide range of applications, particularly in the automotive, industrial control, and consumer electronics sectors.
MC9S12XEP100CAG Relevant information