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LPC18S10FBD144E

LPC18S10FBD144E

Manufacturer No:

LPC18S10FBD144E

Manufacturer:

NXP USA Inc.

Description:

IC MCU 32BIT ROMLESS 144LQFP

Datasheet:

Datasheet

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LPC18S10FBD144E Specifications

  • Type
    Parameter
  • Supplier Device Package
    144-LQFP (20x20)
  • Package / Case
    144-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 8x10b; D/A 1x10b
  • Voltage - Supply (Vcc/Vdd)
    2.2V ~ 3.6V
  • RAM Size
    136K x 8
  • EEPROM Size
    -
  • Program Memory Type
    ROMless
  • Program Memory Size
    -
  • Number of I/O
    83
  • Peripherals
    Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
  • Connectivity
    CANbus, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART
  • Speed
    180MHz
  • Core Size
    32-Bit Single-Core
  • Core Processor
    ARM® Cortex®-M3
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    LPC18xx
The LPC18S10FBD144E integrated circuit (IC) chip is a microcontroller unit (MCU) that offers several advantages and can be used in various application scenarios. Some of its advantages and application scenarios may include:1. High-performance MCU: The LPC18S10FBD144E chip is based on the Arm Cortex-M3 processor, which provides high processing power and performance.2. Extensive I/O capabilities: This chip offers a wide range of input/output (I/O) options, including both analog and digital interfaces, making it suitable for applications that require diverse connectivity and communication options.3. Rich software ecosystem: The LPC18S10FBD144E chip is supported by a comprehensive software ecosystem, which includes development tools, libraries, and application examples. This makes it easier for engineers and developers to design and implement different software applications.4. Low-power consumption: The chip is designed to operate at low power consumption levels, making it suitable for battery-powered applications or scenarios where energy efficiency is essential.5. Embedded applications: The LPC18S10FBD144E chip is often used in various embedded systems such as consumer electronics, industrial automation, robotics, healthcare devices, and smart home applications.6. Communication interfaces: The chip provides a range of communication interfaces, including multiple UART, SPI, and I2C interfaces, enabling seamless connectivity with other devices or peripherals.7. Real-time applications: With its high-performance capabilities, the chip is well-suited for real-time applications that require quick and efficient data processing, such as control systems, motor control, or real-time monitoring.8. Secure applications: The LPC18S10FBD144E chip offers security features like a cryptographic engine, which makes it suitable for applications that require data encryption and secure communication.9. Sensor integration: With its analog-to-digital converters (ADCs) and other sensor interfaces, the chip can be used in applications that require sensor integration, such as environmental monitoring, smart agriculture, or IoT devices.These are just a few examples of the advantages and application scenarios of the LPC18S10FBD144E integrated circuit chip. The actual usage and benefits of the chip would depend on the specific requirements and design considerations of the project at hand.
LPC18S10FBD144E Relevant information