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MC9S08AW32CFDE

MC9S08AW32CFDE

Manufacturer No:

MC9S08AW32CFDE

Manufacturer:

NXP USA Inc.

Description:

IC MCU 8BIT 32KB FLASH 48QFN

Datasheet:

Datasheet

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MC9S08AW32CFDE Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-QFN-EP (7x7)
  • Package / Case
    48-VFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 8x10b
  • Voltage - Supply (Vcc/Vdd)
    2.7V ~ 5.5V
  • RAM Size
    2K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    32KB (32K x 8)
  • Number of I/O
    38
  • Peripherals
    LVD, POR, PWM, WDT
  • Connectivity
    I²C, SCI, SPI
  • Speed
    40MHz
  • Core Size
    8-Bit
  • Core Processor
    S08
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    S08
The MC9S08AW32CFDE is a microcontroller integrated circuit chip developed by NXP Semiconductors. It belongs to the S08 family of microcontrollers and offers several advantages and application scenarios. Some of them include:1. Low Power Consumption: The MC9S08AW32CFDE is designed to operate at low power, making it suitable for battery-powered devices and applications where power efficiency is crucial.2. High Performance: Despite its low power consumption, the chip offers high-performance capabilities, including a 20 MHz CPU, 32 KB flash memory, and 2 KB RAM. This makes it suitable for applications that require both power efficiency and processing power.3. Integrated Peripherals: The chip includes various integrated peripherals, such as analog-to-digital converters (ADC), timers, serial communication interfaces (UART, SPI, I2C), and general-purpose input/output (GPIO) pins. These peripherals enhance the chip's versatility and make it suitable for a wide range of applications.4. Small Form Factor: The MC9S08AW32CFDE comes in a small form factor package, making it suitable for space-constrained applications where size is a critical factor.5. Industrial and Automotive Applications: The chip is designed to meet the requirements of industrial and automotive applications. It can withstand harsh environments, operate at extended temperature ranges, and handle high levels of electromagnetic interference (EMI).6. Cost-Effective Solution: The MC9S08AW32CFDE offers a cost-effective solution for various applications due to its low power consumption, integrated peripherals, and high-performance capabilities.Application scenarios where the MC9S08AW32CFDE can be utilized include:1. Internet of Things (IoT) Devices: The chip's low power consumption, small form factor, and integrated peripherals make it suitable for IoT devices such as smart sensors, wearable devices, and home automation systems.2. Industrial Control Systems: The chip's industrial-grade features, including extended temperature range and EMI resistance, make it suitable for industrial control systems, including motor control, process automation, and monitoring applications.3. Automotive Electronics: The chip's automotive-grade features, such as extended temperature range and robustness, make it suitable for automotive applications, including engine control units (ECUs), dashboard systems, and body control modules.4. Consumer Electronics: The chip's low power consumption, small form factor, and integrated peripherals make it suitable for various consumer electronics applications, including remote controls, smart appliances, and portable devices.5. Medical Devices: The chip's low power consumption and small form factor make it suitable for medical devices, such as portable monitors, wearable health trackers, and medical instruments.Overall, the MC9S08AW32CFDE offers a combination of low power consumption, high performance, integrated peripherals, and industrial-grade features, making it suitable for a wide range of applications in various industries.
MC9S08AW32CFDE Relevant information