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R5F572TKADFP#30

R5F572TKADFP#30

Manufacturer No:

R5F572TKADFP#30

Description:

IC MCU 32BIT 1MB FLASH 100LFQFP

Datasheet:

Datasheet

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R5F572TKADFP#30 Specifications

  • Type
    Parameter
  • Supplier Device Package
    100-LFQFP (14x14)
  • Package / Case
    100-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 24x12b; D/A 2x12b
  • Voltage - Supply (Vcc/Vdd)
    2.7V ~ 5.5V
  • RAM Size
    128K x 8
  • EEPROM Size
    32K x 8
  • Program Memory Type
    FLASH
  • Program Memory Size
    1MB (1M x 8)
  • Number of I/O
    72
  • Peripherals
    DMA, LVD, POR, PWM, WDT
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD, QSPI, SCI, SPI, SSI
  • Speed
    200MHz
  • Core Size
    32-Bit Single-Core
  • Core Processor
    RXv3
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    RX72T
The UPG2008TK-E2-A integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Power Amplification: These chips are designed for high power amplification applications, providing a high output power capability. 2. Wide Frequency Range: They operate in a wide frequency range, typically from 800 MHz to 2.2 GHz, making them suitable for various wireless communication systems. 3. High Efficiency: The chips offer high power-added efficiency, ensuring efficient power consumption and reduced heat dissipation. 4. Compact Size: They come in a compact package, making them suitable for space-constrained applications. 5. Easy Integration: These chips are designed for easy integration into existing circuit designs, simplifying the overall system design process.Application Scenarios: 1. Cellular Base Stations: The UPG2008TK-E2-A chips can be used in cellular base stations to amplify the signals transmitted and received by the antennas, enhancing the coverage and range of the base station. 2. Wireless Communication Systems: They can be used in various wireless communication systems, such as Wi-Fi routers, wireless access points, and wireless local area networks (WLANs), to amplify the signals and improve the overall system performance. 3. Radio Frequency (RF) Transmitters: These chips can be used in RF transmitters to amplify the signals before transmission, ensuring a strong and reliable signal transmission. 4. Satellite Communication Systems: They can be used in satellite communication systems to amplify the signals transmitted from the satellite to the ground station, improving the signal strength and quality. 5. Radar Systems: The chips can be used in radar systems to amplify the radar signals, enabling long-range detection and accurate target tracking.Overall, the UPG2008TK-E2-A integrated circuit chips offer high power amplification, wide frequency range, and compact size, making them suitable for various applications in wireless communication, satellite communication, radar systems, and more.
R5F572TKADFP#30 Relevant information