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MSP430FR4131IG48

MSP430FR4131IG48

Manufacturer No:

MSP430FR4131IG48

Manufacturer:

Texas Instruments

Description:

IC MCU 16BIT 4.5KB FRAM 48TSSOP

Datasheet:

Datasheet

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MSP430FR4131IG48 Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-TSSOP
  • Package / Case
    48-TFSOP (0.240", 6.10mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 8x10b
  • Voltage - Supply (Vcc/Vdd)
    1.8V ~ 3.6V
  • RAM Size
    512 x 8
  • EEPROM Size
    -
  • Program Memory Type
    FRAM
  • Program Memory Size
    4.5KB (4.5K x 8)
  • Number of I/O
    44
  • Peripherals
    Brown-out Detect/Reset, LCD, POR, PWM, WDT
  • Connectivity
    I²C, IrDA, SCI, SPI, UART/USART
  • Speed
    16MHz
  • Core Size
    16-Bit
  • Core Processor
    MSP430 CPU16
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    MSP430™ FRAM
The MSP430FR4131IG48 integrated circuit (IC) chips have several advantages and application scenarios. Here are some of them:Advantages: 1. Ultra-low power consumption: The MSP430FR4131IG48 chips are designed for low-power applications, making them suitable for battery-powered devices, IoT devices, and portable electronics. 2. Integrated FRAM memory: These chips feature Ferroelectric Random Access Memory (FRAM) technology, which offers non-volatile memory with low power consumption and high performance. FRAM memory allows for fast write speed, high endurance, and flexibility. 3. Energy harvesting: The chips support multiple integrated energy harvesting technologies, such as solar energy, thermal energy, and vibration energy. This feature enables self-powered applications without relying solely on batteries or external power sources. 4. Sensor integration: The chips have built-in analog and digital peripherals for easy integration with various sensors, enabling the development of sensor-driven applications. 5. Communication interfaces: They come with a wide range of communication interfaces, including I2C, SPI, UART, and USB, enabling connectivity with other devices and systems.Application Scenarios: 1. Internet of Things (IoT): MSP430FR4131IG48 chips find extensive use in IoT applications due to their low power consumption, integrated FRAM, and energy harvesting capabilities. They can be utilized in remote sensing, asset tracking, smart home automation, and other IoT devices. 2. Wearable Devices: The low-power design, FRAM memory, and sensor integration features make MSP430FR4131IG48 chips suitable for wearable devices such as fitness trackers, smartwatches, and health monitoring devices. 3. Environmental Monitoring: These chips can be used in environmental monitoring systems for sensing and collecting data related to temperature, humidity, air quality, and more. The low power consumption and self-powering features make them ideal for remote monitoring applications. 4. Industrial Automation: MSP430FR4131IG48 chips are used in industrial automation for control systems, monitoring equipment, and sensor interfaces. The energy harvesting capabilities can help in reducing the maintenance and power requirements of industrial devices. 5. Wireless Sensor Networks: These chips can be utilized in wireless sensor networks, enabling the deployment of low-power and long-range networked sensors for applications such as smart agriculture, smart cities, and infrastructure monitoring.These are just a few examples of the advantages and application scenarios of MSP430FR4131IG48 integrated circuit chips. The versatility and low-power characteristics of these chips make them suitable for a wide range of embedded system applications.
MSP430FR4131IG48 Relevant information