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MC9S12XDT512MAA

MC9S12XDT512MAA

Manufacturer No:

MC9S12XDT512MAA

Manufacturer:

NXP USA Inc.

Description:

IC MCU 16BIT 512KB FLASH 80QFP

Datasheet:

Datasheet

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MC9S12XDT512MAA Specifications

  • Type
    Parameter
  • Supplier Device Package
    80-QFP (14x14)
  • Package / Case
    80-QFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Oscillator Type
    External
  • Data Converters
    A/D 8x10b
  • Voltage - Supply (Vcc/Vdd)
    2.35V ~ 5.5V
  • RAM Size
    20K x 8
  • EEPROM Size
    4K x 8
  • Program Memory Type
    FLASH
  • Program Memory Size
    512KB (512K x 8)
  • Number of I/O
    59
  • Peripherals
    LVD, POR, PWM, WDT
  • Connectivity
    CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
  • Speed
    80MHz
  • Core Size
    16-Bit
  • Core Processor
    HCS12X
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    HCS12X
The MC9S12XDT512MAA integrated circuit chips, from NXP Semiconductors, are microcontrollers specifically designed for automotive applications. Some advantages and application scenarios of these chips are:1. Performance: The MC9S12XDT512MAA chips offer high-performance computing capabilities, with a 32-bit HCS12X instruction set architecture. They have a clock frequency of up to 40 MHz and provide efficient processing power for automotive applications.2. Automotive Applications: These chips are specifically designed for automotive applications, making them suited for use in various automotive systems. They can be used in engine control units (ECUs), body control modules (BCMs), powertrain control modules (PCMs), dashboard displays, and other automotive control systems.3. Enhanced Safety: The MC9S12XDT512MAA chips come with integrated safety features, such as fail-safe monitoring, error correction, and built-in self-test capabilities. These features allow for enhanced safety and reliability in automotive systems.4. Connectivity: These chips offer multiple connectivity options, including CAN (Controller Area Network), LIN (Local Interconnect Network), and SCI (Serial Communication Interface) protocols. This enables seamless communication with other automotive components and systems.5. Memory: The MC9S12XDT512MAA chips have a large flash memory capacity of 512 KB, along with 6 KB of RAM. This allows for storage of extensive code and data, making them suitable for complex automotive applications.6. Low Power Consumption: These chips are designed to be power-efficient, ensuring optimized energy consumption in automotive systems. This is crucial for prolonging battery life and reducing power requirements in vehicles.7. Development Support: NXP provides a comprehensive development ecosystem for these chips, including software development tools, reference designs, and technical support. This simplifies the development process for automotive system designers and allows faster time-to-market.Overall, the MC9S12XDT512MAA integrated circuit chips offer high-performance computing, enhanced safety features, automotive-specific applications, and connectivity options suitable for complex automotive systems. These advantages make them popular in the automotive industry for applications such as engine control, body control, and dashboard displays, among others.
MC9S12XDT512MAA Relevant information