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R5F523W8BDNG#30

R5F523W8BDNG#30

Manufacturer No:

R5F523W8BDNG#30

Description:

IC MCU 32BIT 512KB FLASH 56HVQFN

Datasheet:

Datasheet

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R5F523W8BDNG#30 Specifications

  • Type
    Parameter
  • Supplier Device Package
    56-HVQFN (7x7)
  • Package / Case
    56-VFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 12x12b; D/A 1x12b
  • Voltage - Supply (Vcc/Vdd)
    2.7V ~ 3.6V
  • RAM Size
    64K x 8
  • EEPROM Size
    8K x 8
  • Program Memory Type
    FLASH
  • Program Memory Size
    512KB (512K x 8)
  • Number of I/O
    29
  • Peripherals
    Capacitive Touch, DMA, LVD, POR, PWM, WDT
  • Connectivity
    CANbus, I²C, IrDA, SD/SDIO, SPI, SSI, USB OTG
  • Speed
    54MHz
  • Core Size
    32-Bit Single-Core
  • Core Processor
    RXv2
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    RX23W
The R5F523W8BDNG#30 is a specific model of integrated circuit chip developed and manufactured by Renesas Electronics Corporation. Unfortunately, precise details about this particular chip model are not readily available in public sources. It could be a specialized chip designed for specific applications or industries, which might explain the limited information.Usually, understanding the advantages and application scenarios of an integrated circuit chip requires access to its datasheet or technical documentation, which provides detailed information about its features, capabilities, and recommended uses. Without this information, it is not possible to accurately describe the advantages and application scenarios of the R5F523W8BDNG#30 chip.For detailed insights into the benefits and potential applications of the R5F523W8BDNG#30 chip, it is recommended to refer to the official documentation, datasheets, or contact the manufacturer, Renesas Electronics Corporation, directly.
R5F523W8BDNG#30 Relevant information