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DSPIC30F2012-20E/ML

DSPIC30F2012-20E/ML

Manufacturer No:

DSPIC30F2012-20E/ML

Manufacturer:

Microchip Technology

Description:

IC MCU 16BIT 12KB FLASH 28QFN

Datasheet:

Datasheet

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DSPIC30F2012-20E/ML Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-QFN (6x6)
  • Package / Case
    28-VQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 10x12b
  • Voltage - Supply (Vcc/Vdd)
    2.5V ~ 5.5V
  • RAM Size
    1K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    12KB (4K x 24)
  • Number of I/O
    20
  • Peripherals
    Brown-out Detect/Reset, POR, PWM, WDT
  • Connectivity
    I²C, SPI, UART/USART
  • Speed
    20 MIPS
  • Core Size
    16-Bit
  • Core Processor
    dsPIC
  • DigiKey Programmable
    Verified
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    dsPIC™ 30F
The DSPIC30F2012-20E/ML integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-performance Digital Signal Processor (DSP): The chip is equipped with a powerful DSP core that enables efficient and fast signal processing tasks. 2. Enhanced features: It offers enhanced features like high-resolution PWM, motor control peripherals, and advanced analog-to-digital converters (ADCs), making it suitable for applications requiring precise control and measurement. 3. Low power consumption: The chip is designed to operate at low power, making it suitable for battery-powered applications or devices with power constraints. 4. Ample memory: It has sufficient program memory and data memory to accommodate complex algorithms and data storage requirements. 5. Integrated peripherals: The chip includes various integrated peripherals like UART, SPI, I2C, timers, and GPIOs, providing flexibility and ease of integration with other devices.Application scenarios: 1. Motor control: The chip's enhanced motor control peripherals make it suitable for applications like robotics, industrial automation, and electric vehicle control. 2. Power electronics: It can be used in power electronics applications such as inverters, power supplies, and energy management systems, thanks to its high-resolution PWM and advanced ADCs. 3. Audio processing: The DSP capabilities of the chip make it suitable for audio processing applications like audio effects, equalizers, and audio synthesis. 4. Sensor interfacing: With its integrated peripherals and ADCs, the chip can interface with various sensors, making it suitable for applications like data acquisition systems, environmental monitoring, and instrumentation. 5. Communication systems: The chip's UART, SPI, and I2C interfaces enable seamless integration with communication modules, making it suitable for applications like wireless communication, IoT devices, and data logging.Overall, the DSPIC30F2012-20E/ML integrated circuit chips are versatile and can be used in a wide range of applications that require efficient signal processing, precise control, and low power consumption.
DSPIC30F2012-20E/ML Relevant information