DSPIC33FJ64MC802-I/SP
Manufacturer No:
DSPIC33FJ64MC802-I/SP
Manufacturer:
Description:
IC MCU 16BIT 64KB FLASH 28SPDIP
Datasheet:
Delivery:
Payment:
In Stock : 75
Please send RFQ , we will respond immediately.
DSPIC33FJ64MC802-I/SP Specifications
-
TypeParameter
-
Supplier Device Package28-SPDIP
-
Package / Case28-DIP (0.300", 7.62mm)
-
Mounting TypeThrough Hole
-
Operating Temperature-40°C ~ 85°C (TA)
-
Oscillator TypeInternal
-
Data ConvertersA/D 6x10b/12b
-
Voltage - Supply (Vcc/Vdd)3V ~ 3.6V
-
RAM Size16K x 8
-
EEPROM Size-
-
Program Memory TypeFLASH
-
Program Memory Size64KB (64K x 8)
-
Number of I/O21
-
PeripheralsBrown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
-
ConnectivityCANbus, I²C, IrDA, LINbus, SPI, UART/USART
-
Speed40 MIPs
-
Core Size16-Bit
-
Core ProcessordsPIC
-
DigiKey ProgrammableNot Verified
-
PackagingTube
-
Product StatusActive
-
SeriesdsPIC™ 33F
The DSPIC33FJ64MC802-I/SP integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are based on the dsPIC33F core, which offers high performance and efficient execution of complex algorithms. 2. Digital Signal Processing (DSP) Capabilities: The chips have built-in DSP instructions and peripherals, making them suitable for applications that require real-time signal processing. 3. Enhanced Connectivity: They feature multiple communication interfaces such as UART, SPI, I2C, and CAN, enabling seamless connectivity with other devices. 4. Rich Peripherals: The chips offer a wide range of peripherals like timers, PWM modules, ADCs, and DACs, providing flexibility in designing various applications. 5. Low Power Consumption: They are designed to operate at low power, making them suitable for battery-powered applications. 6. Robustness and Reliability: These chips are designed to withstand harsh environments and offer high reliability.Application Scenarios: 1. Motor Control: The DSPIC33FJ64MC802-I/SP chips are commonly used in motor control applications, such as industrial automation, robotics, and electric vehicles. Their high-performance DSP capabilities and rich peripherals make them ideal for precise motor control algorithms. 2. Power Electronics: These chips can be used in power electronics applications like inverters, power supplies, and energy management systems. Their ability to handle complex algorithms and communicate with other devices makes them suitable for power conversion and control. 3. Audio Processing: The DSP capabilities of these chips make them suitable for audio processing applications like audio effects, audio synthesis, and audio amplification. 4. Communication Systems: With their multiple communication interfaces, these chips can be used in communication systems such as wireless sensor networks, IoT devices, and data loggers. 5. Medical Devices: The chips can be utilized in medical devices like patient monitoring systems, medical imaging, and diagnostic equipment, where real-time signal processing and connectivity are crucial. 6. Automotive Applications: The robustness and reliability of these chips make them suitable for automotive applications like engine control units, dashboard systems, and safety systems.Overall, the DSPIC33FJ64MC802-I/SP integrated circuit chips offer high performance, DSP capabilities, and connectivity options, making them versatile for a wide range of applications in various industries.
DSPIC33FJ64MC802-I/SP Relevant information
-
LM3S8538-IQC50-A2
Texas Instruments -
LM3S1937-IQC50-A2
Texas Instruments -
LM3S1637-IQC50-A2
Texas Instruments -
LM3S1635-IQC50-A2
Texas Instruments -
LM3S1332-IQC50-A2
Texas Instruments -
LM3S1165-IQC50-A2
Texas Instruments -
LM3S1162-IQC50-A2
Texas Instruments -
LM3S1133-IQC50-A2
Texas Instruments -
LM3S308-IQN25
Texas Instruments -
P89LPC936FA,529
NXP USA Inc.