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DSPIC33FJ32GS606-I/MR

DSPIC33FJ32GS606-I/MR

Manufacturer No:

DSPIC33FJ32GS606-I/MR

Manufacturer:

Microchip Technology

Description:

IC MCU 16BIT 32KB FLASH 64VQFN

Datasheet:

Datasheet

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DSPIC33FJ32GS606-I/MR Specifications

  • Type
    Parameter
  • Supplier Device Package
    64-VQFN (9x9)
  • Package / Case
    64-VFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 16x10b; D/A 1x10b
  • Voltage - Supply (Vcc/Vdd)
    3V ~ 3.6V
  • RAM Size
    4K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    32KB (32K x 8)
  • Number of I/O
    58
  • Peripherals
    Brown-out Detect/Reset, QEI, POR, PWM, WDT
  • Connectivity
    I²C, IrDA, LINbus, SPI, UART/USART
  • Speed
    40 MIPs
  • Core Size
    16-Bit
  • Core Processor
    dsPIC
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    dsPIC™ 33F
The DSPIC33FJ32GS606-I/MR integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are based on the dsPIC33F core, which offers high performance and efficient execution of complex algorithms. 2. Digital Signal Processing (DSP) Capabilities: The chips have built-in DSP instructions and peripherals, making them suitable for applications that require real-time signal processing. 3. Enhanced Connectivity: They feature various communication interfaces like UART, SPI, I2C, CAN, USB, and Ethernet, enabling seamless connectivity with other devices. 4. Rich Peripherals: The chips come with a wide range of peripherals, including timers, PWM modules, ADCs, DACs, comparators, and more, providing flexibility in designing complex systems. 5. Low Power Consumption: They have low power modes and features like Sleep, Idle, and Doze, making them suitable for battery-powered applications.Application Scenarios: 1. Motor Control: The chips' high-performance DSP capabilities and PWM modules make them ideal for motor control applications, such as robotics, industrial automation, and electric vehicles. 2. Power Electronics: They can be used in power electronics applications like inverters, power supplies, and energy management systems, where real-time control and high-performance signal processing are required. 3. Communication Systems: The chips' communication interfaces and DSP capabilities make them suitable for applications like wireless communication systems, IoT devices, and networked control systems. 4. Audio and Speech Processing: They can be used in audio and speech processing applications, such as audio amplifiers, audio effects processors, voice recognition systems, and digital audio players. 5. Medical Devices: The chips' high-performance processing and low power consumption make them suitable for medical devices like patient monitoring systems, medical imaging, and diagnostic equipment.Overall, the DSPIC33FJ32GS606-I/MR integrated circuit chips offer high performance, DSP capabilities, connectivity options, and low power consumption, making them suitable for a wide range of applications in various industries.
DSPIC33FJ32GS606-I/MR Relevant information