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DSPIC33EV32GM102-E/SS

DSPIC33EV32GM102-E/SS

Manufacturer No:

DSPIC33EV32GM102-E/SS

Manufacturer:

Microchip Technology

Description:

IC MCU 16BIT 32KB FLASH 28SSOP

Datasheet:

Datasheet

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DSPIC33EV32GM102-E/SS Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-SSOP
  • Package / Case
    28-SSOP (0.209", 5.30mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 11x10/12b
  • Voltage - Supply (Vcc/Vdd)
    4.5V ~ 5.5V
  • RAM Size
    4K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    32KB (11K x 24)
  • Number of I/O
    21
  • Peripherals
    Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
  • Connectivity
    CANbus, I²C, IrDA, LINbus, SPI, UART/USART
  • Speed
    60 MIPs
  • Core Size
    16-Bit
  • Core Processor
    dsPIC
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100, dsPIC™ 33EV, Functional Safety (FuSa)
The DSPIC33EV32GM102-E/SS integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are based on the dsPIC33E core, which offers high performance and efficient execution of complex algorithms. 2. Digital Signal Processing (DSP) Capabilities: The chips have built-in DSP instructions and peripherals, making them suitable for applications that require real-time signal processing. 3. Enhanced Connectivity: They feature various communication interfaces like UART, SPI, I2C, and CAN, enabling seamless connectivity with other devices. 4. Rich Peripherals: The chips come with a wide range of peripherals, including timers, PWM modules, ADCs, and DACs, providing flexibility for different application requirements. 5. Low Power Consumption: They are designed to operate at low power, making them suitable for battery-powered applications. 6. Robustness and Reliability: These chips are designed to withstand harsh environments and have built-in protection features like CRC, ECC, and memory lock to ensure data integrity.Application Scenarios: 1. Motor Control: The chips' high-performance DSP capabilities and PWM modules make them ideal for motor control applications, such as industrial automation, robotics, and electric vehicles. 2. Power Electronics: They can be used in power electronics applications like inverters, power supplies, and renewable energy systems, where real-time control and high efficiency are crucial. 3. Audio Processing: The DSP capabilities of these chips make them suitable for audio processing applications like audio effects, audio synthesis, and digital audio amplifiers. 4. Communication Systems: With their built-in communication interfaces, these chips can be used in various communication systems, including wireless communication, IoT devices, and networking equipment. 5. Medical Devices: The chips' high performance, low power consumption, and robustness make them suitable for medical devices like patient monitoring systems, medical imaging, and diagnostic equipment. 6. Automotive Electronics: They can be used in automotive applications like engine control units, dashboard systems, and advanced driver-assistance systems (ADAS) due to their robustness and real-time processing capabilities.Overall, the DSPIC33EV32GM102-E/SS integrated circuit chips offer high performance, DSP capabilities, and a wide range of peripherals, making them suitable for various applications that require real-time signal processing, connectivity, and low power consumption.
DSPIC33EV32GM102-E/SS Relevant information