DSPIC30F6010-30I/PF
Manufacturer No:
DSPIC30F6010-30I/PF
Manufacturer:
Description:
IC MCU 16BIT 144KB FLASH 80TQFP
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In Stock : 58
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DSPIC30F6010-30I/PF Specifications
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TypeParameter
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Supplier Device Package80-TQFP (14x14)
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Package / Case80-TQFP
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Oscillator TypeInternal
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Data ConvertersA/D 16x10b
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Voltage - Supply (Vcc/Vdd)2.5V ~ 5.5V
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RAM Size8K x 8
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EEPROM Size4K x 8
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Program Memory TypeFLASH
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Program Memory Size144KB (48K x 24)
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Number of I/O68
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PeripheralsBrown-out Detect/Reset, LVD, Motor Control PWM, QEI, POR, PWM, WDT
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ConnectivityCANbus, I²C, SPI, UART/USART
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Speed30 MIPs
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Core Size16-Bit
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Core ProcessordsPIC
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesdsPIC™ 30F
The DSPIC30F6010-30I/PF integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-performance: The DSPIC30F6010-30I/PF chips are based on the dsPIC30F architecture, which offers high-performance digital signal processing capabilities. They have a 30 MIPS (Million Instructions Per Second) performance, making them suitable for demanding applications. 2. Integrated peripherals: These chips come with a wide range of integrated peripherals such as analog-to-digital converters (ADCs), digital-to-analog converters (DACs), timers, UARTs, SPI, I2C, and more. This integration reduces the need for external components and simplifies the design process. 3. Enhanced features: The DSPIC30F6010-30I/PF chips have enhanced features like motor control PWM, quadrature encoder interface, and advanced analog features. These features make them suitable for applications requiring motor control, power conversion, and sensor interfacing. 4. Low power consumption: These chips are designed to operate at low power, making them suitable for battery-powered applications or devices with power constraints. 5. Robust communication capabilities: The chips support various communication protocols like UART, SPI, I2C, CAN, and USB. This enables seamless communication with other devices or systems.Application scenarios: 1. Motor control: The DSPIC30F6010-30I/PF chips are commonly used in motor control applications such as robotics, industrial automation, and electric vehicles. The integrated PWM modules and motor control peripherals make them ideal for controlling the speed, direction, and torque of motors. 2. Power electronics: These chips are suitable for power electronics applications like power inverters, uninterruptible power supplies (UPS), and solar inverters. The high-performance DSP capabilities and integrated analog features enable precise control and monitoring of power conversion processes. 3. Sensor interfacing: The integrated ADCs and advanced analog features make these chips suitable for applications that require sensor interfacing. This includes applications like temperature sensing, pressure sensing, and environmental monitoring. 4. Communication systems: The robust communication capabilities of these chips make them suitable for applications in communication systems. They can be used in devices like modems, routers, and wireless communication modules. 5. Consumer electronics: The low power consumption and high-performance capabilities of these chips make them suitable for various consumer electronics applications like smart home devices, wearable devices, and audio systems.Overall, the DSPIC30F6010-30I/PF integrated circuit chips offer high-performance digital signal processing capabilities, integrated peripherals, and low power consumption, making them suitable for a wide range of applications in motor control, power electronics, sensor interfacing, communication systems, and consumer electronics.
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