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DSPIC33EV256GM102-I/SP

DSPIC33EV256GM102-I/SP

Manufacturer No:

DSPIC33EV256GM102-I/SP

Manufacturer:

Microchip Technology

Description:

IC MCU 16BIT 256KB FLASH 28SPDIP

Datasheet:

Datasheet

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DSPIC33EV256GM102-I/SP Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-SPDIP
  • Package / Case
    28-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Oscillator Type
    Internal
  • Data Converters
    A/D 11x10/12b
  • Voltage - Supply (Vcc/Vdd)
    4.5V ~ 5.5V
  • RAM Size
    16K x 8
  • EEPROM Size
    -
  • Program Memory Type
    FLASH
  • Program Memory Size
    256KB (85.5K x 24)
  • Number of I/O
    21
  • Peripherals
    Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
  • Connectivity
    CANbus, I²C, IrDA, LINbus, SPI, UART/USART
  • Speed
    70 MIPs
  • Core Size
    16-Bit
  • Core Processor
    dsPIC
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    dsPIC™ 33EV, Functional Safety (FuSa)
The DSPIC33EV256GM102-I/SP integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are based on the dsPIC33E core, which offers high performance and efficient execution of complex algorithms. 2. Digital Signal Processing (DSP) Capabilities: The chips have built-in DSP instructions and peripherals, making them suitable for applications that require real-time signal processing. 3. Enhanced Connectivity: They feature various communication interfaces like UART, SPI, I2C, and CAN, enabling seamless connectivity with other devices. 4. Rich Peripherals: The chips come with a wide range of peripherals, including timers, PWM modules, ADCs, and DACs, providing flexibility for different application requirements. 5. Low Power Consumption: They are designed to operate at low power, making them suitable for battery-powered applications. 6. Robustness and Reliability: These chips are designed to withstand harsh environments and offer high reliability.Application Scenarios: 1. Motor Control: The DSPIC33EV256GM102-I/SP chips are commonly used in motor control applications, such as industrial automation, robotics, and electric vehicles. Their high-performance DSP capabilities and rich peripherals make them ideal for precise motor control algorithms. 2. Power Electronics: These chips can be used in power electronics applications like inverters, power supplies, and renewable energy systems. Their high-speed ADCs and PWM modules enable accurate control of power conversion processes. 3. Audio Processing: The DSP capabilities of these chips make them suitable for audio processing applications like audio effects, audio synthesis, and digital audio amplifiers. 4. Communication Systems: With their enhanced connectivity options, these chips can be used in communication systems like wireless sensor networks, IoT devices, and data loggers. 5. Medical Devices: The chips' robustness, low power consumption, and DSP capabilities make them suitable for medical devices like patient monitoring systems, medical imaging, and diagnostic equipment.Overall, the DSPIC33EV256GM102-I/SP integrated circuit chips offer high performance, DSP capabilities, and rich peripherals, making them versatile for a wide range of applications requiring real-time signal processing and control.
DSPIC33EV256GM102-I/SP Relevant information